Integrated Radiator Reservoir Cooling Loop for Low-Leak Electronics
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Solution Overview
Problem
Conventional liquid cooling systems for electronics are cumbersome, noisy, and inefficient at high processor speeds, with complex designs that increase installation time and risk of leakage due to external component placement requirements.
Innovation Solution
A liquid cooling system with a radiator having built-in fluid tank reservoirs and a multi-fan unit, where the cooling fluid loop includes a heat exchanger pump and flexible conduits made from metalized plastic to minimize fluid loss and noise, with control mechanisms for adjusting pump speed based on cooling demand.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional liquid cooling systems use external fluid reservoirs and multiple separate components, then the system can provide adequate cooling capacity, but installation time increases and risk of leakage increases
Solution Approach 1:
The patent integrates the fluid reservoir directly into the radiator structure, creating a single unified component that combines two previously separate elements. This merging eliminates the need for external reservoirs and multiple connecting hoses, thereby reducing installation complexity and potential leakage points while maintaining the cooling system's functionality.
Solution Approach 2:
The integrated radiator-reservoir structure serves multiple functions simultaneously: it acts as both the heat dissipation radiator and the fluid storage reservoir. This multi-functionality reduces the total number of components needed in the system, simplifying installation and reducing potential failure points.
2Productivity
If conventional liquid cooling systems use multiple separate components with hoses and attachment mechanisms, then the system can be assembled, but total installation time increases
Solution Approach 1:
By combining the reservoir and radiator into a single integrated unit, the patent eliminates the need for separate component placement and hose routing. This reduces the number of assembly steps required during installation, directly decreasing installation time and improving productivity.
3Ease of operation
If air-cooling systems are used for everyday uses, then the system is simple to implement, but it becomes noisy and less effective at higher processor speeds
Solution Approach 1:
The patent employs a liquid cooling system that uses fluid circulation through the radiator to transfer heat away from processors. This hydraulic approach is inherently more efficient at heat transfer than air cooling, allowing the system to maintain effectiveness at higher processor speeds while operating more quietly than high-performance air cooling solutions.
4Ease of manufacture
If liquid cooling systems position components outside the electronic device housing, then component placement is simplified, but hoses and attachment mechanisms are required increasing complexity
Solution Approach 1:
The integrated radiator-reservoir design eliminates the need for external component placement and the associated hoses and attachments. By combining functions into a single unit that can be positioned within the housing, the system simplifies the overall configuration while maintaining ease of installation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces installation time, minimizes noise and vibration, and enhances cooling efficiency by integrating components, reducing the need for external reservoirs and minimizing fluid loss, while allowing for flexible configuration to handle increased heat loads.
Implementation Method 1
Heat generated from a heat generating device is transferred to a cooling fluid
Implementation Method 2
a multi-fan unit that forces air through a radiator to remove heat
Implementation Method 3
The cooling fluid is pumped by a heat exchanger pump
Data Source
AI summary
A liquid cooling system is provided. The liquid cooling system comprises a radiator having first and second built-in fluid tank reservoirs, a multi-fan unit, at least one heat exchanger pump, and a plurality of fluid conduits. The radiator comprises at least one first flow port and at least one second flow port for attachment of the plurality of fluid conduits thereto for actively moving a cooling fluid to and from the at least one heat exchanger pump. Heat generated from a heat generating device is transferred to cooling fluid flowing through the at least one heat exchanger pump, and then output to the radiator. The heated cooling fluid flows through the radiator having the built-in fluid tank, cooling along a plurality of heat exchanger fins, whereby the multi-fan unit expels heat therefrom. The cooling fluid flows to the heat exchanger pump to once again begin the cooling loop.