Integrated Radiator Pump for Liquid Cooling Leakage Reduction
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Solution Overview
Problem
Conventional active liquid cooling systems for electronic devices are complex, prone to leakage, and require multiple hoses and internal component placement, which complicates maintenance and increases the risk of damage during repairs.
Innovation Solution
An integrated cooling apparatus with a radiator and pump forming a one-piece unit, reducing the number of hoses needed to two and allowing for external or internal mounting, featuring a pump housing with a detachable design for easy access and a plenum for efficient coolant circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional active liquid cooling systems use multiple individual components (pump, reservoir, heat exchanger, contact block) connected by hoses, then the system can achieve effective heat transfer, but the device complexity increases and leakage risks increase
Solution Approach 1:
The patent integrates the pump, reservoir, and heat exchanger into a single unified assembly that attaches directly to the contact block. This merging eliminates the need for multiple separate components connected by hoses, thereby reducing leakage points while maintaining the cooling function. The integrated design allows the pump to be positioned within the housing structure, eliminating external hose connections.
2Ease of repair
If conventional systems position the pump externally with multiple hose connections, then the pump can be accessed for maintenance, but the complexity of hose management and connection increases
Solution Approach 1:
The patent divides the integrated assembly into modular sections with a removable lower housing portion. This segmentation allows the pump to be accessed by simply removing the lower housing, eliminating the need to disconnect hoses or disassemble the entire assembly. The modular design provides pump accessibility while maintaining the integrated structure that reduces overall system complexity.
3Ease of operation
If conventional systems use three hoses (outlet, delivery, inlet) connecting separate components, then the cooling loop can be established, but the number of connection locations increases to six
Solution Approach 1:
The patent combines the functions of the outlet hose, delivery hose, and inlet hose into a single integrated cooling loop. The pump draws coolant from the reservoir through an internal inlet, pushes it through the heat exchanger, and returns it to the reservoir through an internal outlet, eliminating the need for three separate external hoses and six connection locations.
4Reliability
If conventional systems place all cooling components inside the electronic device, then the cooling is remote and effective, but disassembly is required for maintenance increasing time and cost
Solution Approach 1:
The patent designs the integrated cooling assembly as a removable module that can be detached from the contact block. This segmentation allows the entire cooling system (pump, reservoir, heat exchanger) to be removed as one unit for maintenance, eliminating the need to disassemble the electronic device. The modular design maintains effective cooling while significantly reducing maintenance time and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the cooling system, reduces leakage risks, and facilitates easier maintenance by eliminating the need for external pumps and minimizing disassembly requirements, while maintaining effective heat transfer performance.
Implementation Method 1
A radiator with integrated pump for actively cooling electronic devices
Implementation Method 2
heat transfer capabilities
Implementation Method 3
movement of the cooling fluid through the closed-loop system is provided by a pump
Implementation Method 4
The contact block generally includes the region where the cooling fluid engages in thermal contact with the heat generating circuit component
Data Source
AI summary
An integrated cooling apparatus for actively cooling one or more electronic components in an electronic device such as a computer is provided. The cooling apparatus includes a radiator and a pump integrally mounted on the radiator. The pump can include a pump housing having a first pump housing member attached to the radiator and a second pump housing member detachably securable to the first pump housing member. The apparatus includes a flow inlet and a flow outlet for attaching hoses or conduits to the radiator for actively moving a liquid coolant to and from an external or remote heat exchanger via tubing. An external heat exchanger can be fluidly connected to the integrated cooling apparatus via two or more tubes and thermally attached to the electronic component to be cooled, such as a computer graphics card, microprocessor or other circuit component.