Integrated Radio Package with Multi-Directional Antenna Array
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Solution Overview
Problem
Traditional integrated radio packages with built-in antennas require multiple unidirectional antennas oriented in different directions to form a multi-directional array, increasing cost and complexity.
Innovation Solution
An integrated radio package with a built-in multi-directional antenna array, utilizing a three-dimensional Wilkinson power combiner/divider structure and additive manufacturing for efficient antenna placement and signal routing, allowing for a single package to span multiple directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple unidirectional antenna packages are used to form a multi-directional array, then the antenna coverage in multiple directions is improved, but the device cost and structural complexity increase
Solution Approach 1:
The patent combines multiple unidirectional antenna elements into a single integrated radio package, merging what would traditionally require multiple separate packages into one unified structure. The antenna array is built within the package itself, with multiple antenna elements oriented in different directions, eliminating the need for multiple separate packages and reducing overall system complexity.
Solution Approach 2:
The integrated radio package serves multiple functions simultaneously: it provides radio functionality through the IC die and multi-directional antenna coverage through the integrated antenna array. This single package replaces what would traditionally require multiple specialized packages, achieving multi-functionality and reducing the overall number of components needed.
2Reliability
If multiple unidirectional antenna packages are deployed to achieve multi-directional coverage, then the signal reception in various directions is improved, but the deployment cost increases
Solution Approach 1:
The patent merges multiple antenna functions into a single package, reducing the number of components that need to be manufactured, tested, and deployed. This consolidation lowers material costs, assembly costs, and deployment costs while maintaining the multi-directional signal reception capability through the integrated antenna array.
3Adaptability or versatility
If multiple separate packages are used to provide multi-directional antenna coverage, then the directional signal transmission is improved, but the alignment complexity increases
Solution Approach 1:
The patent eliminates alignment complexity by integrating multiple antenna elements with different orientations within a single package. The antennas are fixed in their respective directions during manufacturing, eliminating the need for field alignment that would be required if multiple separate packages were deployed. The IC die is electrically connected to all antenna elements through integrated routing structures.
Data Source
AI summary
A semiconductor device package having at least one integrated circuit (IC) die, at least two antennas oriented in at least two different directions, and a combiner/divider structure connecting the at least two antennas to the at least one IC die and configured to combine/divide signals transmitted between the at least two antennas and the at least one IC die. The package may be fabricated using an additive manufacturing process (i.e., 3D printing). In certain embodiments, the package is an integrated radio package having a multi-directional antenna array.