Integrated RF Die Eliminating Serial Interface Latency
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Solution Overview
Problem
The integration of serial interfaces in radio-frequency front end modules for 5G NR introduces significant latency due to separate silicon CMOS and SOI die, making it difficult to meet the stringent timing constraints of modern communication protocols like 5G NR, where tighter timing specifications and shorter cyclic prefix require faster transition times.
Innovation Solution
Integrating a power amplifier controller, low noise amplifier, antenna switch, and band select switch onto a single die, eliminating the need for serial interfaces and reducing latency by allowing direct communication between these components, while maintaining isolation requirements through a single MiPi connection for both transmit and receive paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If components are implemented on separate silicon CMOS and SOI die with serial interfaces, then device complexity is reduced and manufacturing is easier, but latency increases and timing constraints cannot be met
Solution Approach 1:
The patent integrates the power amplifier controller, low noise amplifier, and antenna switch onto a single die, eliminating the need for serial interfaces between separate die. This merging of previously separate components directly reduces latency by removing serial communication delays while maintaining all necessary functions within one integrated device.
2Manufacturing precision
If serial interfaces are used for communication between separate die, then manufacturing precision requirements are reduced, but timing constraints are violated due to interface delay
Solution Approach 1:
By combining the power amplifier controller, low noise amplifier, and antenna switch into a single die, the patent eliminates serial interfaces entirely. This removes the timing delays associated with serial communication while the integrated design maintains appropriate manufacturing precision requirements for the unified device structure.
3Loss of time
If components are integrated onto a single die, then latency is reduced and timing constraints are met, but device complexity increases
Solution Approach 1:
The patent merges the power amplifier controller, low noise amplifier, and antenna switch onto a single die, achieving latency reduction by eliminating serial interfaces. The complexity is managed through integrated design where these components share common infrastructure and control pathways within the unified die structure.
Solution Approach 2:
The single die is designed to perform multiple functions - power amplification, low noise amplification, and antenna switching - all within one integrated device. This multi-functionality approach consolidates what would otherwise require separate components and interfaces, managing complexity while achieving the latency improvements needed for 5G NR timing constraints.
Data Source
AI summary
Aspects of the disclosure include a die and corresponding radio-frequency module and wireless mobile device. Examples of the die include, integral to the die, a power amplifier controller, a low noise amplifier, and an antenna switch in communication with both the power amplifier controller and the low noise amplifier.