Integrated Semiconductor Package for Battery Protection Circuit

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Solution Overview

Problem

Existing protection circuit modules for lithium-type secondary batteries are bulky due to separate semiconductor packages for the integrated circuit and switches, increasing the printed circuit board area, volume, and manufacturing costs, while also being susceptible to electromagnetic interference and static electricity.

Innovation Solution

Integration of the integrated circuit, charging switch, and discharging switch into a single semiconductor package on a printed circuit board with reduced wiring patterns, encapsulated to minimize electromagnetic interference and static electricity risks, and reduce soldering operations and costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate semiconductor packages are used for the integrated circuit and switches, then the circuit functionality is reliable, but the printed circuit board area and volume increase

Engineering Contradiction:
Improvecircuit functionalityVSAvoidprinted circuit board area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent combines the integrated circuit, charging switch, and discharging switch into a single integrated semiconductor package. This merging of previously separate components reduces the number of discrete parts on the printed circuit board, thereby reducing the overall board area while maintaining the necessary circuit functionality through integrated protection and control operations.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated semiconductor package performs multiple functions simultaneously: voltage sensing, charging control, discharging control, and protection operations. By designing a universal package that handles all these functions, the patent eliminates the need for separate dedicated components for each function, thus reducing the printed circuit board area while preserving complete circuit functionality.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If separate semiconductor packages are used for the integrated circuit and switches, then the circuit design is modular, but the volume and manufacturing cost increase

Engineering Contradiction:
Improvemodular designVSAvoidbattery pack volume
Core Design Contradiction:
Device complexityVSVolume of stationary object

Solution Approach 1:

The patent merges the integrated circuit and power switches into a single integrated package, reducing the total volume occupied by multiple separate components. This consolidation eliminates gaps and mounting space between discrete components, thereby reducing the overall battery pack volume while maintaining design simplicity through a unified structure.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If multiple separate components are used, then the circuit functionality is complete, but the number of soldering operations and manufacturing cost increase

Engineering Contradiction:
Improvecircuit functionalityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple functional components into a single integrated semiconductor package, reducing the number of separate soldering operations required. This merging maintains complete circuit functionality while simplifying the manufacturing process by reducing assembly steps, soldering joints, and potential defect points, thereby lowering manufacturing costs.

Inventive Principle:
Principle #5Merging (Combining)

4Reliability

If extensive wiring patterns are used to connect components, then the circuit connections are reliable, but the susceptibility to electromagnetic interference and static electricity increases

Engineering Contradiction:
Improvecircuit connectionsVSAvoidelectromagnetic interference susceptibility
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent integrates the circuit components within a single semiconductor package, minimizing the external wiring patterns required for connections. This integration reduces the exposed conductive paths that could act as antennas for electromagnetic interference or static electricity discharge, thereby maintaining reliable internal connections while reducing susceptibility to external harmful factors.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS7692405B2Single unit protection circuit module and battery pack using the same
Publication Date: 2010.04.06 SAMSUNG SDI CO LTD
  • US7692405B2 patent drawing
  • US7692405B2 patent drawing
  • US7692405B2 patent drawing

AI summary

A protection circuit module includes a printed circuit board in which at least one wiring pattern is formed, a conductive pad that is coupled to a wiring pattern of the printed circuit board, and is electrically coupled to a rechargeable battery, and a semiconductor package that is soldered on the wiring pattern of the printed circuit board, so that if the voltage of the rechargeable battery is in the overcharged or over-discharged state, the semiconductor package selectively blocks a charging path or a discharging path of the rechargeable battery.