Integrated Semiconductor Package Layout for Low-Noise Power Circuits
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Solution Overview
Problem
Existing power supply circuits in electric products and electric vehicles face challenges in reducing noise, increasing the area required for wiring, and ensuring stable manufacturing quality due to the separation and stacking of switching elements and passive components.
Innovation Solution
A semiconductor device design where the switching element and semiconductor element are integrated with shortened conduction distances and overlapping configurations, reducing noise and wiring area, and stabilizing the manufacturing process by stacking the elements in the thickness direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If switching elements and passive components are separated and stacked on mounting substrate, then manufacturing process becomes stable, but noise increases and wiring area increases
Solution Approach 1:
The patent merges the switching element and passive components into a single integrated semiconductor device. The switching element, diode, and capacitor are constructed together in a integrated structure with direct electrical connections, eliminating the need for separate mounting on a substrate and reducing the number of external connections required.
Solution Approach 2:
The patent transitions from a planar layout on a mounting substrate to a three-dimensional integrated structure. The passive components are positioned in spatial relationship to the switching element within the same semiconductor package, utilizing vertical and lateral space efficiently to reduce wiring length while maintaining manufacturing stability.
2Manufacturing precision
If switching elements and passive components are separated and stacked on mounting substrate, then manufacturing process becomes stable, but wiring area increases
Solution Approach 1:
The patent merges the switching element and passive components into a single integrated semiconductor device. The switching element, diode, and capacitor are constructed together in a integrated structure with direct electrical connections, eliminating the need for separate mounting on a substrate and reducing the number of external connections required.
Solution Approach 2:
The patent transitions from a planar layout on a mounting substrate to a three-dimensional integrated structure. The passive components are positioned in spatial relationship to the switching element within the same semiconductor package, utilizing vertical and lateral space efficiently to reduce wiring length while maintaining manufacturing stability.
3Object-generated harmful factors
If switching elements and passive components are integrated with shortened conduction distances, then noise is reduced and wiring area is minimized, but manufacturing complexity increases
Solution Approach 1:
The patent merges the switching element and passive components into a single integrated semiconductor device. The switching element, diode, and capacitor are constructed together in a integrated structure with direct electrical connections, eliminating the need for separate mounting on a substrate and reducing the number of external connections required.
Solution Approach 2:
The integrated semiconductor device is divided into distinct functional regions: a switching element region containing the switching element, and a passive component region containing the diode and capacitor. This segmentation allows for specialized manufacturing processes for each region while maintaining overall integration, simplifying the manufacturing process despite the integrated design.
Data Source
AI summary
The semiconductor device includes a switching element having a first electrode, a second electrode and a third electrode, a semiconductor element having a fourth electrode and a fifth electrode, a sealing resin covering the switching element and the semiconductor element, and a plurality of terminals partially exposed from the sealing resin. The first electrode and the fourth electrode are electrically connected inside the sealing resin. The plurality of terminals include a first terminal, a second terminal, and a third terminal. The first terminal electrically conducts to the second electrode. The second terminal electrically conducts to the fifth electrode. The third terminal electrically conducts to each of the first electrode and the fourth electrode. The first terminal and the second terminal are adjacent to each other.