Integrated Semiconductor Package for Multiphase Power Converters
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Solution Overview
Problem
Existing semiconductor packages for multiphase power converters are bulky, complex, and costly due to the use of discrete transistors, which complicates assembly and increases the likelihood of faulty connections.
Innovation Solution
The integration of high-side and low-side transistors into single semiconductor dies within a semiconductor package, which reduces the size, assembly complexity, and cost, while minimizing the risk of solder-related issues, and allows for faster and less complex assembly by soldering fewer components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete transistors are used in semiconductor packages for multiphase power converters, then the package can be assembled with individual components, but the package becomes bulky, complex, and costly with increased likelihood of faulty connections
Solution Approach 1:
The patent merges multiple discrete transistors into a single integrated semiconductor die containing a multiphase power converter circuit. This integration eliminates the need for separate discrete transistor components, reducing assembly complexity and the likelihood of faulty connections while maintaining the required power conversion functionality.
2Adaptability or versatility
If discrete transistors are used in semiconductor packages, then individual components can be replaced or upgraded, but the package size increases and assembly becomes more complex
Solution Approach 1:
The patent combines multiple transistor functions into a single integrated semiconductor die, significantly reducing the overall package size. The integrated design maintains adaptability through programmable control logic that can be configured for different power conversion requirements, eliminating the need for physical component replacement while providing flexibility.
3Ease of manufacture
If discrete transistors are used in multiphase power converters, then the circuit can be built with standard components, but the assembly process becomes slower and more complex
Solution Approach 1:
The patent integrates the multiphase power converter circuit into a single semiconductor die, transforming a multi-step assembly process involving multiple discrete components into a single-component installation. This dramatically simplifies the manufacturing process and increases assembly speed while maintaining ease of manufacture through standardized packaging.
4Adaptability or versatility
If discrete transistors are used in power converter packages, then the design can be modified by changing individual components, but the package becomes costlier
Solution Approach 1:
The patent consolidates multiple discrete transistor components into a single integrated semiconductor die, reducing the quantity of components from multiple separate parts to one unified component. Design flexibility is maintained through programmable control logic and configurable circuit parameters that allow modification without physical component changes.
Data Source
AI summary
In some examples, a device includes a power supply element and a reference voltage element, wherein the reference voltage element is electrically isolated from the power supply element. The device further includes a high-side semiconductor die including at least two high-side transistors, wherein each high-side transistor of the at least two high-side transistors is electrically connected to the power supply element. The device also includes a low-side semiconductor die including at least two low-side transistors, wherein each low-side transistor of the at least two low-side transistors is electrically connected to the reference voltage element. The device includes at least two switching elements, wherein each switching element of the at least two switching elements is electrically connected to a respective high-side transistor of the at least two high-side transistors and to a respective low-side transistor of the at least two low-side transistors.