Integrated Semiconductor Package with Passive Components
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Solution Overview
Problem
Conventional semiconductor packages for power processing circuits, such as DC-DC converters and voltage regulators, occupy excessive circuit board area due to the separate mounting of semiconductor devices and passive components.
Innovation Solution
Integration of semiconductor devices and passive components within a semiconductor package on a substrate, including an IC die, conductive pads, and a metallic body for heat dissipation, with conductive vias providing interconnections and proximity to reduce parasitics and circuit board space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If passive components are mounted on the circuit board in close proximity to the semiconductor package, then the overall footprint of the power processing circuit is reduced, but the circuit board area consumed is still undesirable
Solution Approach 1:
The patent merges passive components (capacitors, resistors, inductors) directly into the semiconductor package substrate, combining previously separate components (semiconductor devices on package, passive components on circuit board) into a single integrated unit. This integration eliminates the need for separate mounting of passive components on the circuit board, thereby reducing the overall circuit board area while maintaining all necessary circuit functions within the package itself.
2Area of stationary object
If semiconductor devices and passive components are integrated in a semiconductor package, then circuit board space is reduced, but parasitics may increase due to close proximity
Solution Approach 1:
The patent applies different local qualities to different regions of the integrated package by implementing optimized trace routing patterns, strategic placement of passive components relative to semiconductor devices, and controlled impedance design. These localized design variations minimize parasitic effects in critical areas while maintaining the benefits of integration, thereby reducing both circuit board area and harmful parasitics simultaneously.
3Temperature
If passive components are integrated with semiconductor devices on the substrate, then heat dissipation is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent designs the substrate to serve multiple functions simultaneously: it acts as the mounting platform for semiconductor devices, provides integration pathways for passive components, establishes electrical interconnections through traces and vias, and functions as a heat dissipation structure. This multi-functional substrate design enables heat dissipation enhancement through integrated thermal pathways while managing manufacturing complexity through a unified structure that eliminates the need for separate thermal management components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces the overall circuit board area required for power processing circuits by placing passive components and semiconductor devices in close proximity, minimizing parasitics and enhancing transient response and heat dissipation.
Implementation Method 1
a metallic body for heat dissipation
Data Source
AI summary
According to one exemplary embodiment, a semiconductor package includes a substrate having lower and upper surfaces. The semiconductor package further includes at least one passive component coupled to first and second conductive pads on the upper surface of the substrate. The semiconductor package further includes at least one semiconductor device coupled to a first conductive pad on the lower surface of the substrate. The at least one semiconductor device has a first electrode for electrical and mechanical connection to a conductive pad external to the semiconductor package. The at least one semiconductor device can have a second electrode electrically and mechanically coupled to the first conductive pad on the lower surface of the substrate.