Integrated Semiconductor Package with Stress Relaxation
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Solution Overview
Problem
Semiconductor packages with sensor chips bonded to lead frames require multiple components and increase physical size due to the need for a lead frame and adhesive materials, which complicates manufacturing and increases the risk of component breakage during assembly.
Innovation Solution
A semiconductor device and production method that integrate a semiconductor element, electronic component, and connection member within a sealing resin portion, eliminating the need for a lead frame and adhesive materials, and incorporating a stress relaxation member to manage thermal expansion differences, thereby reducing component count and package size while minimizing stress on the semiconductor element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a lead frame and adhesive materials are used to bond sensor chips, then the semiconductor package can be assembled, but the number of components increases and the physical size increases
Solution Approach 1:
The patent merges the lead frame, adhesive materials, and sealing resin into a single integrated sealing resin portion. The sealing resin directly bonds the semiconductor element to the support board without requiring separate lead frames or adhesive layers, thereby reducing component count while maintaining assembly capability.
Solution Approach 2:
The sealing resin portion performs multiple functions simultaneously: it seals the semiconductor element, bonds it to the support board, provides electrical insulation, and manages thermal expansion. This multi-functionality eliminates the need for separate lead frames and adhesive materials.
2Ease of manufacture
If a lead frame and adhesive materials are used to bond sensor chips, then the semiconductor package can be assembled, but the physical size increases
Solution Approach 1:
By combining the lead frame, adhesive, and sealing resin into a single integrated sealing resin portion, the patent eliminates the cumulative thickness and volume of separate components, thereby reducing the overall package size while maintaining assembly capability.
Solution Approach 2:
The patent extracts and eliminates the lead frame and adhesive materials from the traditional multi-component structure, retaining only the essential sealing and bonding functions performed by the integrated sealing resin portion.
3Ease of manufacture
If adhesive materials are used to bond the semiconductor element, then the component can be assembled, but the risk of component breakage increases
Solution Approach 1:
The patent merges the bonding and sealing functions into a single sealing resin portion that provides uniform support and protection to the semiconductor element, eliminating the interface between separate adhesive and sealing components where stress concentration and breakage could occur.
Solution Approach 2:
The patent changes the material parameters by using a sealing resin with controlled elasticity and adhesion properties that can accommodate thermal expansion while providing strong bonding, thereby reducing stress on the semiconductor element during temperature cycling.
4Device complexity
If thermal expansion differences between materials are not managed, then the manufacturing is simpler, but stress on the semiconductor element increases
Solution Approach 1:
The patent changes the physical parameters of the sealing resin by selecting materials with elastic moduli and thermal expansion coefficients that match or complement those of the semiconductor element and support board, thereby minimizing thermal stress while maintaining manufacturing simplicity.
Solution Approach 2:
The patent uses composite material properties in the sealing resin portion, combining materials with different thermal and mechanical characteristics to create a gradient structure that accommodates thermal expansion differences between the semiconductor element and support board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the number of components and physical size of the semiconductor device, enhances detection sensitivity, and minimizes the risk of component breakage by eliminating the need for a lead frame and adhesive materials, while effectively managing thermal expansion stresses through the use of a stress relaxation member.
Implementation Method 1
incorporating a stress relaxation member to manage thermal expansion differences, thereby reducing component count and package size while minimizing stress on the semiconductor element
Data Source
AI summary
A semiconductor device includes a semiconductor element, an electronic component electrically connected to the semiconductor element, a connection member electrically connecting the electronic component to the semiconductor element, and a sealing resin portion having a first surface and a second surface opposite to the first surface and integrally holding the semiconductor element, the electronic component, and the connection member in a state where a semiconductor top surface as a surface of the semiconductor element and a component surface as a surface of the electronic component are exposed from the sealing resin portion on a side adjacent to the first surface.