Integrated Semiconductor Substrate Design for Manufacturing Simplification
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Solution Overview
Problem
The manufacturing process of semiconductor devices is complex and costly due to the need for multiple steps, including molding and bonding, which also limits improvements in electrical and thermal characteristics.
Innovation Solution
A semiconductor device design featuring a substrate with insulating layers and circuit patterns, where semiconductor elements are directly joined to the substrate, and main and control terminals are extended for external connection, eliminating the need for a separate case and reducing the number of manufacturing steps by using a sealing member to encase the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate case is used to house the substrate and terminals are insert molded, then the device structure is stable and protected, but the manufacturing process becomes complex with multiple steps including molding and bonding
Solution Approach 1:
The patent merges the case and substrate into a single integrated substrate structure. The substrate includes a base portion forming the case and a protruding portion forming the electrode, eliminating the need for separate case and terminal components. This integration reduces manufacturing steps by removing the molding and bonding processes while maintaining structural stability and protection.
2Reliability
If multiple manufacturing steps including molding and bonding are used, then the device achieves proper assembly and connection, but the manufacturing cost increases
Solution Approach 1:
The integrated substrate design combines multiple components into one, eliminating the molding and bonding steps. The substrate is formed as a single piece with the base portion and protruding electrode portion, reducing manufacturing complexity and cost while ensuring proper assembly through the unified structure design.
Solution Approach 2:
The substrate is segmented into functional portions (base portion for case, protruding portion for electrode) that are formed integrally. This segmentation within integration allows each portion to fulfill its specific function while avoiding the need for separate components and assembly steps.
3Reliability
If bonding wires are used to connect circuit patterns to main terminals, then electrical connection is achieved, but the manufacturing process requires additional steps and members
Solution Approach 1:
The circuit patterns are directly formed on the substrate base portion, integrating the electrical connection path into the substrate itself. This eliminates the need for separate bonding wires and connection steps, as the electrical connection is achieved through the substrate's conductive structure.
4Device complexity
If the control integrated circuit is disposed in the case region, then the device achieves compact integration, but noise interference may affect the control signals
Solution Approach 1:
The substrate is segmented into distinct functional regions: the base portion for control circuitry and the protruding portion for power electrodes. This spatial segmentation separates the control integrated circuit from the high-power switching elements, reducing noise interference while maintaining compact integration within the unified substrate structure.
Data Source
AI summary
A semiconductor device, including a substrate having an insulating layer and a plurality of circuit patterns formed on the insulating layer, the substrate having a principal surface on which an element region is set. The semiconductor device further includes a plurality of semiconductor elements provided on the plurality of circuit patterns in the element region, a plurality of main terminals that each have a first end joined to one of the plurality of circuit patterns in the element region and a second end extending out of the substrate from a first side of the substrate, a plurality of control terminals disposed in a control region that is adjacent to a second side of the substrate opposite the first side, and a sealing member that seals the principal surface and the control region.