Integrated Humidity and Pressure Sensor Layout for Low Parasitic Capacitance
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Solution Overview
Problem
Existing integrated circuit (IC) packaging with separate pressure and humidity sensor dies leads to increased parasitic capacitance, reduced signal-to-noise ratio, and limited miniaturization due to sub-optimal vent hole placement and separate sensor dies.
Innovation Solution
Integration of environmental and temperature sensors with measurement circuitry on an ASIC die, including capacitors and local heating elements, to create a compact environment monitoring product with improved signal-to-noise ratio and efficient battery power use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate sensor dies are used for pressure and humidity sensing, then the sensors can be independently optimized, but parasitic capacitance increases and signal-to-noise ratio decreases
Solution Approach 1:
The patent combines pressure sensing, humidity sensing, and temperature sensing onto a single integrated sensor die. The capacitive pressure sensor, capacitive humidity sensor, and temperature sensor are all formed on the same die, eliminating the need for separate sensor dies. This integration reduces parasitic capacitance between separate components and improves the signal-to-noise ratio while maintaining independent optimization capabilities for each sensing function.
2Adaptability or versatility
If separate sensor dies are stacked on ASIC die, then functional integration is achieved, but package size increases and miniaturization is limited
Solution Approach 1:
The patent merges pressure sensing, humidity sensing, and temperature sensing onto a single sensor die that can be directly integrated with the ASIC die. This consolidation eliminates the need for multiple stacked sensor dies, significantly reducing the overall package volume while maintaining full functional integration for environmental monitoring.
3Measurement precision
If heating elements are added for temperature control, then temperature compensation is improved, but power consumption increases
Solution Approach 1:
The patent incorporates temperature sensors that provide accurate temperature measurements for compensation purposes. The system uses the measured temperature data to compensate for temperature effects on the pressure and humidity sensing measurements, achieving accurate temperature compensation without requiring active heating elements that would consume significant battery power.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances signal-to-noise ratio, optimizes sensor placement, and enables miniaturization by integrating sensors within the ASIC die, reducing parasitic capacitance and improving the positioning of vent holes for better ambient exposure.
Implementation Method 1
an environmentally sensitive material formed between, and optionally around, the first and second capacitor terminals as a dielectric, the environmentally sensitive dielectric material being responsive to a selected environmental characteristic so as to cause a measurable change in capacitance and/or electrical charge across the capacitor structure
Implementation Method 2
an environmentally sensitive material formed between, and optionally around, the first and second capacitor terminals as a dielectric, the environmentally sensitive dielectric material being responsive to a selected environmental characteristic so as to cause a measurable change in capacitance
Implementation Method 3
integrated local heating elements
Data Source
AI summary
Novel integrated circuit environmental and temperature sensors in combination with measurement circuitry fully integrated as part of an ASIC die, which may be co-packaged with a pressure sensor integrated circuit to create a compact yet sensitive environment monitoring product. Embodiments may include one or more integrated local heating elements and control circuitry that are power supply independent, make efficient use of battery power, include an accurate in-built temperature detection capability, and provide digital close-loop control of the heating elements.