Integrated Series Shunt Capacitor for Output Matching Network

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Solution Overview

Problem

Existing output matching networks (OMN) for semiconductor structures face challenges in minimizing insertion loss and maintaining compact layout due to sensitivity to process variations and higher dielectric loss tangent of thin-film insulating materials, especially when integrating separate series and shunt capacitors.

Innovation Solution

Integrating a large series capacitor and a smaller shunt capacitor into a single physical component, utilizing the substrate's thicker dielectric constant to provide required shunt capacitance, which minimizes OMN insertion loss and decouples DC bias while maintaining a compact layout by eliminating interconnects between capacitors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If separate series and shunt capacitors are used in the output matching network, then DC blocking and impedance transformation functions are achieved, but the circuit occupies larger area and has higher insertion loss due to separate interconnects

Engineering Contradiction:
ImproveOMN insertion lossVSAvoidnumber of capacitor components
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent combines the series capacitor and shunt capacitor into a single integrated capacitor component. The series capacitor provides both DC blocking and shunt capacitance functions simultaneously, eliminating the need for separate capacitor components and their interconnects. This merging reduces the number of components, minimizes interconnect parasitics, and lowers overall insertion loss in the output matching network.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If separate series and shunt capacitors are used with interconnects, then required capacitance values are achieved, but process variations affect performance due to sensitivity of small shunt capacitors

Engineering Contradiction:
Improvesensitivity to process variationsVSAvoidcapacitance value sensitivity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

By integrating both capacitor functions into a single component, the patent eliminates the small separate shunt capacitor that is highly sensitive to process variations. The unified capacitor structure uses the same fabrication process for both series and shunt capacitance, reducing sensitivity to manufacturing variations and improving reliability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single capacitor component performs multiple functions: it provides DC blocking through its series configuration and simultaneously provides the required shunt capacitance for impedance transformation. This multi-functionality approach eliminates the need for separate specialized components, reducing overall sensitivity to process variations.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Loss of energy

If thin-film insulating materials are used for separate capacitors, then compact integration is achieved, but dielectric loss increases due to higher loss tangent

Engineering Contradiction:
Improvedielectric lossVSAvoidchip area
Core Design Contradiction:
Loss of energyVSArea of stationary object

Solution Approach 1:

The integrated capacitor structure allows the use of thicker substrate dielectric materials that have lower loss tangents. By combining both capacitor functions in one component, the design can utilize the substrate's thicker dielectric constant to provide the required shunt capacitance, reducing dielectric losses compared to separate thin-film capacitor implementations.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces OMN insertion loss and makes the circuit less sensitive to fabrication process variations, achieving efficient impedance transformation and compact layout with lower dielectric loss tangent compared to standalone shunt capacitors.

Implementation Method 1

utilizing the substrate's thicker dielectric constant to provide required shunt capacitance

Methodology Applied
Scientific EffectDielectric: Dielectric

Implementation Method 2

A series capacitor and shunt capacitor are formed in a vertically stacked relationship as a combined single series and shunt capacitor component

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentEP3213411B1Output matching network having a single combined series and shunt capacitor component
Publication Date: 2019.07.17 RAYTHEON CO
  • EP3213411B1 patent drawingFigure 1~1C
  • EP3213411B1 patent drawingFigure 1A~1B
  • EP3213411B1 patent drawingFigure 2A~2C

AI summary

A matching network requiring a predetermined shunt capacitance in a transformation of the impedance at the output to a transistor to a load. The matching network includes a vertically stacked shunt capacitor, for providing the entire predetermined capacitance, and a series DC blocking capacitor.