Integrated Shield Package for EMI Control and Heat Dissipation
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Solution Overview
Problem
Electronic component packages generate electromagnetic interference (EMI) that can interfere with surrounding devices, and existing solutions require separate operations for mounting components and shields, increasing manufacturing complexity and costs.
Innovation Solution
An integrated shield electronic component package is designed with a substrate, electronic component, and a single-piece integrated shield made of conductive material that covers the component and substrate, providing comprehensive EMI shielding and acting as a heat sink, thereby simplifying assembly and reducing costs by integrating the shielding within the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate operations are used for mounting electronic components and shields, then EMI shielding can be provided, but manufacturing complexity and costs increase
Solution Approach 1:
The patent combines the EMI shield with the electronic component package into a single integrated structure. The shield is formed as an integral part of the package substrate, eliminating the need for separate shield mounting operations. This merging of functions reduces manufacturing steps, lowers complexity, and decreases assembly costs while maintaining effective EMI shielding.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for electronic components, acts as the mounting platform for components, and simultaneously functions as the EMI shield. This multi-functionality eliminates the need for dedicated shield structures, simplifying the overall device architecture and manufacturing process.
2Reliability
If separate operations are used for mounting electronic components and shields, then EMI shielding can be provided, but assembly costs increase
Solution Approach 1:
By integrating the EMI shield into the package substrate itself, the patent eliminates separate shield mounting operations. This reduces the number of assembly steps, lowers labor costs, and simplifies the manufacturing process while ensuring effective EMI shielding is maintained throughout the package structure.
3Device complexity
If integrated shield is used, then manufacturing process is simplified, but shield must cover component and substrate effectively
Solution Approach 1:
The integrated shield is formed as a monolithic structure with the package substrate, ensuring precise coverage of both the substrate and mounted components. This integration eliminates alignment issues between separate shield and package components, as the shield boundaries are inherently defined by the package structure itself, achieving both simplification and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated shield effectively prevents EMI from the component and substrate from interfering with surrounding devices while also dissipating heat, simplifying the manufacturing process and reducing overall assembly costs by eliminating the need for separate shielding operations.
Implementation Method 1
An integrated shield 128 is mounted to upper surface 102U of substrate 102. Integrated shield 128 covers electronic component 104 and upper surface 102U of substrate 102. Integrated shield 128 includes a side shielding portion 136 directly adjacent to and covering sides 102S of substrate 102.
Implementation Method 2
An integrated shield electronic component package is designed with a substrate, electronic component, and a single-piece integrated shield made of conductive material that covers the component and substrate, providing comprehensive EMI shielding and acting as a heat sink
Data Source
AI summary
An integrated shield electronic component package includes a substrate having an upper surface, a lower surface, and sides extending between the upper surface and the lower surface. An electronic component is mounted to the upper surface of the substrate. An integrated shield is mounted to the upper surface of the substrate and includes a side shielding portion directly adjacent to and covering the sides of the substrate. The integrated shield covers and provides an electromagnetic interference (EMI) shield for the electronic component, the upper surface and sides of substrate. Further, the integrated shield is integrated within the integrated shield electronic package. Thus, separate operations of mounting an electronic component package and then mounting a shield are avoided thus simplifying manufacturing and reducing overall assembly costs.