Integrated Shielding Package Layout for EMI-Safe Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face challenges in miniaturization due to the occupation of space by shielding walls, which also limit wiring and product functionality.
Innovation Solution
An electronic package design where the packaging module integrates a semiconductor chip with a shielding structure, allowing it to serve as a shielding wall without occupying additional planar space, achieved by forming a shielding layer on an encapsulation layer that exposes the shielding structure, thereby reducing the carrier structure's dimensions and routing area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding wall is disposed around semiconductor chips to prevent electromagnetic interference, then EMI protection is improved, but the area of the packaging substrate surface is reduced and wiring space is limited
Solution Approach 1:
The patent combines the shielding wall function with the packaging module by integrating a shielding structure directly into the packaging module. The packaging module includes a semiconductor chip, packaging compound, and shielding structure covering at least one side of the chip, allowing the same component to serve both packaging and EMI shielding purposes, thereby eliminating the need for separate shielding walls on the substrate surface.
Solution Approach 2:
The patent transitions the shielding function from a planar arrangement (shielding walls on substrate surface) to a vertical/three-dimensional arrangement (shielding structure integrated within packaging modules). The shielding structure covers the sides of semiconductor chips vertically, providing EMI protection without occupying horizontal substrate surface area, thus resolving the space conflict.
2Object-affected harmful factors
If a shielding wall is disposed on the packaging substrate surface to protect semiconductor chips, then EMI protection is improved, but the wiring routing capability is limited
Solution Approach 1:
The patent merges the shielding function with the packaging module, allowing the packaging module to serve dual purposes: protecting the semiconductor chip and providing EMI shielding. This integration eliminates the need for separate shielding walls that would constrain wiring routing, thereby improving the adaptability and versatility of the packaging substrate for various wiring configurations.
3Area of stationary object
If the packaging substrate area is reduced for miniaturization, then product size is reduced, but shielding wall placement becomes more difficult
Solution Approach 1:
The patent integrates the shielding structure directly into the packaging module, combining multiple functions (chip mounting, encapsulation, and EMI shielding) into a single modular unit. This integration simplifies the manufacturing process by eliminating separate shielding wall placement steps, making miniaturization easier to achieve without compromising shielding effectiveness.
Solution Approach 2:
The patent shifts the shielding approach from horizontal placement on the substrate surface to vertical integration within the packaging module. This dimensional change allows EMI protection to be achieved within the module's three-dimensional structure, facilitating substrate miniaturization while maintaining shielding capability.
Data Source
AI summary
An electronic package is provided, in which electronic elements and at least one packaging module including a semiconductor chip and a shielding structure covering the semiconductor chip are disposed on a carrier structure, an encapsulation layer encapsulates the electronic elements and the packaging module, and a shielding layer is formed on the encapsulation layer and in contact with the shielding structure. Therefore, the packaging module includes the semiconductor chip and the shielding structure and has a chip function and a shielding wall function simultaneously.