Integrated Shunt Package for Accurate Current Sensing

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Solution Overview

Problem

Current power electronic components face challenges in accurately measuring current with low spatial requirements and cost-effectiveness, as existing solutions like shunt resistors and magnetic sensors are expensive and space-consuming.

Innovation Solution

A molded electronic component with an integrated current sensor featuring a shunt between a load terminal and a sense terminal, where the shunt has a higher specific resistance than the connection, ensuring a temperature-independent voltage drop for accurate current measurement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If separate shunt resistors or magnetic sensors are used for current sensing, then measurement precision is improved, but area of stationary object increases and manufacturing cost increases

Engineering Contradiction:

Improvecurrent measurement accuracyVSAvoidboard space

Core Design Contradiction:

Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent merges the current sensing function into the power electronic component itself by integrating a shunt between the load terminal and sense terminal. This eliminates the need for separate external shunt resistors or magnetic sensors, thereby reducing board space while maintaining current measurement capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The power electronic component is designed to serve multiple functions: power switching and current sensing. The integrated shunt allows the component to perform both power handling and measurement functions, reducing the total component count and board space requirements.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Measurement precision

If separate shunt resistors or magnetic sensors are used for current sensing, then measurement precision is improved, but manufacturing cost increases

Engineering Contradiction:

Improvecurrent measurement accuracyVSAvoidmanufacturing cost

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The current sensing function is combined with the power electronic component, eliminating the need for separate expensive shunt resistors or magnetic sensors. This integration reduces component count and overall manufacturing cost while maintaining measurement accuracy.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The power electronic component performs its own current sensing function through the integrated shunt, eliminating the need for additional external sensing components. This self-service capability reduces both cost and complexity.

Inventive Principle:

Principle #25Self-service

3Measurement precision

If magnetic sensors with additional pins are used, then measurement precision is improved, but device complexity increases

Engineering Contradiction:

Improvecurrent sensing capabilityVSAvoidconnection pins

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The sensing function is merged into the existing terminal structure of the power electronic component. The shunt is integrated between the load terminal and sense terminal, utilizing existing connections rather than requiring additional pins or external components.

Inventive Principle:

Principle #5Merging (Combining)

4Area of stationary object

If chip-integrated current measurement cells are used, then area of stationary object is reduced, but measurement precision decreases

Engineering Contradiction:

Improvecomponent sizeVSAvoidcurrent measurement accuracy

Core Design Contradiction:

Area of stationary objectVSMeasurement precision

Solution Approach 1:

The shunt is integrated directly into the power electronic component's terminal structure, combining the benefits of compact size with maintained measurement accuracy. The integration approach preserves the electrical characteristics needed for accurate sensing while minimizing space.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated current sensor provides accurate and cost-effective current measurement with minimal space requirements, reducing temperature-dependent voltage variations and enhancing measurement precision.

Implementation Method 1

the shunt has a higher specific resistance than the first connection, and wherein a resistance of the shunt varies by less than 10 percent over a normal operating temperature range of the molded electronic component

Methodology Applied

Scientific EffectElectrical Resistance: Electrical Resistance

Data Source

PatentUS20250323184A1Molded Electronic Component Having a Shunt Between a Load Terminal and a Sense Terminal

Publication Date: 2025.10.16 INFINEON TECHNOLOGIES AG

AI summary

A molded electronic component includes a power semiconductor die, a load terminal, a sense terminal separate from the load terminal, and a shunt. The power semiconductor die is at least partly embedded in a mold compound. The load terminal and the sense terminal are each partly embedded in the mold compound. A first side of the shunt is attached to the load terminal. The molded electronic component includes a first connection between a first contact pad of the power semiconductor die and a second side of the shunt opposite the first side, and a second connection between the sense terminal and the second side of the shunt. The shunt has a higher specific resistance than the first connection. A resistance of the shunt varies by less than 10 percent over a normal operating temperature range of the molded electronic component.