Integrated Silicon Photonics Optical Interconnects

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Solution Overview

Problem

Current fiber optic switch modules are constrained by high power consumption, cost, and limited panel density due to the architecture of central switch ICs connected to optical transceivers, which degrades high-speed signals and requires complex equalization circuits.

Innovation Solution

Integration of a silicon photonics chip with photodetectors and modulators, coupled with a planar lightwave circuit (PLC), eliminates the need for optical transceivers by directly routing optical signals, reducing power consumption and increasing panel density through optical interconnects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If optical transceivers are used to connect switch ICs, then optical signal transmission is achieved, but power consumption increases and panel density is limited

Engineering Contradiction:

Improvepower consumptionVSAvoidpanel density

Core Design Contradiction:

Use of energy by moving objectVSEase of operation

Solution Approach 1:

The patent merges the optical transceiver functions directly into the switch IC by integrating photodetectors, modulators, and optical waveguides onto the same semiconductor chip. This integration eliminates the need for separate optical transceiver modules, thereby reducing power consumption and increasing panel density by removing the physical space requirements of discrete transceiver components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the mechanical/electrical connection system (electrical links and separate transceiver modules) with an optical system integrated directly on the chip. By using on-chip optical waveguides and modulators, the system eliminates the need for physical electrical interconnects between the switch IC and transceivers, reducing power consumption and enabling higher density configurations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If electrical links are used to connect transceivers to switch IC, then signal transmission is achieved, but signal degradation occurs requiring complex equalization circuits

Engineering Contradiction:

Improvesignal qualityVSAvoidequalization circuits

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent substitutes electrical signal transmission with optical signal transmission by integrating photodetectors and modulators directly on the switch IC. Optical signals do not suffer from the same degradation issues as electrical signals over short distances, eliminating the need for complex equalization circuits and improving signal quality while reducing system complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces optical waveguides as an intermediary medium to transmit signals directly between the modulators and photodetectors on the same chip. This optical intermediary eliminates the need for electrical interconnects and associated equalization circuits, providing reliable signal transmission without degradation.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If separate optical transceivers are used, then optical-to-electrical conversion is achieved, but cost increases

Engineering Contradiction:

Improveoptical signal conversionVSAvoidcost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the optical transceiver functions (photodetectors for optical-to-electrical conversion and modulators for electrical-to-optical conversion) directly into the switch IC. This integration eliminates the need for separate, costly optical transceiver modules while maintaining the required optical signal conversion capabilities, thereby reducing overall system cost.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The switch IC is designed to perform multiple functions including switching, optical-to-electrical conversion via integrated photodetectors, and electrical-to-optical conversion via integrated modulators. This multi-functional integration eliminates the need for separate dedicated transceiver components, reducing cost while maintaining full optical signal conversion capability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces power consumption, eliminates the need for costly optical transceivers, and increases front panel density, enabling higher bandwidth and efficiency in datacenter applications.

Implementation Method 1

a silicon photonics chip including photodetectors for use in converting first optical signals to first electrical signals

Methodology Applied

Scientific EffectPhotoelectric effect: Photoelectric Effect

Implementation Method 2

modulators for modulating second optical signals in accordance with second electrical signals

Methodology Applied

Scientific EffectElectro-optic effect: Electro-Optic Effects

Data Source

PatentUS10178452B2Optical interconnect having optical splitters and modulators integrated on same chip

Publication Date: 2019.01.08 BROADEX TECH UK LTD

AI summary

A switch module includes a switch integrated circuit (IC), an InP chip, and a planar lightwave circuit (PLC). The InP chip may include a plurality of light sources, an optical splitter, and a plurality of modulators.