Integrated SIM and Storage Semiconductor IC Card

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Solution Overview

Problem

Current communication devices require separate slots for SIM cards and storage devices, limiting their ability to perform both subscriber authentication and data storage functions simultaneously without occupying additional external card slots.

Innovation Solution

A semiconductor IC card with an integrated SIM circuit and nonvolatile storage device, featuring SIM pins and memory pins on its surface, allowing it to perform both subscriber authentication and data storage functions while sharing a single external card slot.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If separate SIM card and storage device are used, then subscriber authentication and data storage functions are performed, but multiple external card slots are required

Engineering Contradiction:

Improvefunctional integrationVSAvoidnumber of card slots

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines the SIM card and storage device into a single integrated semiconductor IC card that includes both a SIM circuit for subscriber authentication and a nonvolatile memory device for data storage. This merging eliminates the need for separate card slots while maintaining both functions simultaneously.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated semiconductor IC card is designed to perform multiple functions including subscriber authentication via the SIM circuit and data storage via the nonvolatile memory device. This multi-functional design allows a single card to replace what previously required separate SIM card and storage device slots.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS10445024B2Semiconductor integrated circuit cards and communication systems including the same

Publication Date: 2019.10.15 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor integrated card includes an external package, a subscriber identification module (SIM) circuit, a plurality of SIM pins, a storage device and a plurality of memory pins. The SIM circuit is formed inside of the external package and is configured to store subscriber information. The SIM pins are formed on a surface of the external package and are electrically connected to the SIM circuit. The storage device is formed inside of the external package and is separated from the SIM circuit. The storage device includes a nonvolatile memory device. The memory pins are formed on the surface of the external package and are electrically connected to the storage device.