Integrated Socket Interposer for Thermal and EMI Management
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Solution Overview
Problem
The vulnerability of massively integrated semiconductor systems to performance degradation due to inadequate thermal dissipation and electromagnetic shielding, as well as poor signal integrity, is not adequately addressed by the use of interposers alone.
Innovation Solution
A system-in-package with an integrated socket that includes interposers and a socket configured to provide electrical and thermal connections, as well as electromagnetic shielding, using a socket formed from conductive materials or non-metal materials with electrical routing and ground planes, to enhance thermal dissipation and protect against electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interposers are used to electrically couple active dies to the package substrate, then power and ground connections as well as I/O signals can be provided to multiple active dies, but the system becomes vulnerable to performance degradation due to inadequate thermal dissipation and electromagnetic shielding
Solution Approach 1:
The patent combines the interposer and socket into a single integrated structure where the socket is formed as an extension of the interposer. This integration allows the socket to provide both electrical coupling functions and electromagnetic shielding/thermal dissipation functions that were previously separate, thereby resolving the contradiction between achieving reliable electrical connections and protecting against electromagnetic interference.
Solution Approach 2:
The integrated socket-interposer structure serves multiple functions simultaneously: it provides electrical coupling between dies and substrate, offers electromagnetic shielding through its conductive material composition, enables thermal dissipation through ground plane connections, and provides mechanical support. This multi-functionality allows a single component to address multiple performance concerns that would otherwise require separate elements.
2Productivity
If more active dies are co-packaged to increase integration density, then system functionality is enhanced, but thermal dissipation becomes increasingly inadequate leading to performance degradation
Solution Approach 1:
The patent merges thermal management functionality into the electrical interconnection structure by forming the socket as an integrated extension of the interposer with built-in ground planes and thermal pathways. This allows heat from multiple co-packaged dies to be dissipated through the same structural elements that provide electrical connections, enabling high integration density without compromising thermal performance.
3Reliability
If a socket is added to provide electromagnetic shielding and thermal management, then performance reliability is improved, but device complexity increases
Solution Approach 1:
The patent eliminates the need for separate electromagnetic shielding structures and thermal management components by integrating these functions directly into the socket-interposer structure. The socket is formed as a single piece with the interposer, incorporating ground planes and thermal pathways within the same manufacturing process, thereby improving reliability without adding device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated socket system effectively addresses thermal dissipation and electromagnetic interference issues, ensuring reliable performance and signal integrity in massively integrated semiconductor systems by providing a common ground and enhanced thermal management.
Implementation Method 1
a socket formed from conductive materials or non-metal materials with electrical routing and ground planes, to enhance thermal dissipation
Implementation Method 2
a socket configured to provide electrical and thermal connections, as well as electromagnetic shielding
Data Source
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AI summary
There are disclosed herein various implementations of a system-in-package with integrated socket. In one such implementation, the system-in-package (100) includes a first active die (110) having a first plurality of electrical connectors on a top surface of the first active die, an interposer (130) situated over the first active die, and a second active die (120) having a second plurality of electrical connectors on a bottom surface of the second active die. The interposer is configured to selectively couple at least one of the first plurality of electrical connectors to at least one of the second plurality of electrical connectors. In addition, a socket (160) encloses the first and second active dies and the interposer, the socket being electrically coupled to at least one of the first active die, the second active die, and the interposer.