Integrated Solder Ball Loading Mask for PCB Alignment
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Solution Overview
Problem
Existing solder ball loading methods for printed wiring boards face challenges in securely and accurately loading solder balls onto connection pads, often resulting in misalignment, warping, or multiple balls on a single pad, due to the complexity of flux application and mask alignment.
Innovation Solution
A solder ball loading method using a mask with integrally formed main body and spacer, where the mask is aligned with the printed wiring board to drop solder balls through openings, ensuring accurate positioning and uniform height, and a solder ball loading apparatus with a movable table and airflow unit for precise control and removal of excess balls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a mask with separate spacer and main body is used for solder ball loading, then alignment flexibility is improved, but manufacturing precision deteriorates due to misalignment between components
Solution Approach 1:
The patent combines the spacer and mask main body into a single integrated mask structure. The spacer is formed as an integral part of the mask main body, eliminating the interface between separate components that caused misalignment. This unified structure ensures precise positioning of solder balls on connection pads without the alignment errors that occurred with separate components.
2Reliability
If complex flux application process is used, then solder ball adhesion is improved, but device complexity increases
Solution Approach 1:
The integrated mask structure performs multiple functions including flux containment, solder ball positioning, and alignment guidance in a single component. The mask design inherently manages the flux application process through its structure, eliminating the need for separate complex flux application steps while maintaining reliable solder ball adhesion.
3Ease of manufacture
If multiple separate components are used for mask and spacer, then ease of manufacture is improved, but productivity deteriorates due to assembly time
Solution Approach 1:
By integrating the spacer and mask main body into one piece, the patent eliminates the assembly step required for separate components. The single integrated mask can be directly positioned and used for solder ball loading, significantly reducing setup time and increasing productivity while maintaining the functional benefits of both spacer and mask structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method securely loads solder balls on each connection pad, reduces the probability of misalignment or multiple balls on a single pad, and maintains uniform height, enhancing the manufacturing process and yield by ensuring all pads are correctly loaded without damaging the solder resist layer.
Implementation Method 1
a first airflow unit causes an airflow into the solder ball removal tube
Data Source
AI summary
A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.