Integrated Spring Contact for Semiconductor Control Electrode
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Solution Overview
Problem
Current power semiconductor modules with press pack cells have complex constructions, leading to increased assembly costs and reliability issues due to the need for separate insertion and fixation of spring elements, which complicates the assembly process and increases the risk of faults.
Innovation Solution
A power semiconductor module design featuring a semiconductor assembly with a spring element that is electrically and mechanically connected to the control electrode, allowing for simplified assembly and integration into a press pack housing, where the spring element is used to apply pressure and contact a circuit board, reducing assembly complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spring elements are separately inserted and fixed into guides of the press pack housing, then the control electrode terminals can be positioned and oriented, but the assembly process becomes more complex and assembly costs increase
Solution Approach 1:
The spring element is integrated directly with the control electrode terminal to form a single unified component. This merging eliminates the need for separate insertion and fixation steps, reducing assembly complexity while maintaining reliable positioning and electrical connection.
2Reliability
If spring elements are separately inserted and fixed into guides, then control electrode terminals can be secured, but additional fault sources are introduced and assembly costs increase
Solution Approach 1:
By combining the spring element and control electrode terminal into one integrated component, the number of separate parts is reduced, eliminating additional fault sources associated with separate insertion and fixation operations while lowering assembly costs.
3Ease of operation
If separate insertion of spring elements is required, then positioning of control electrode terminals can be achieved, but the number of assembly steps increases
Solution Approach 1:
The integrated design allows the control electrode terminal with its spring element to be installed as a single unit, reducing the number of assembly steps and improving production speed while maintaining accurate positioning capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design simplifies the assembly process, reduces assembly costs, and enhances reliability by integrating the spring element directly with the semiconductor assembly, facilitating cost-effective and process-reliable production of power semiconductor modules.
Implementation Method 1
a spring element for the pressure contacting of the control electrode with a pressure force generated by the spring element
Data Source
AI summary
A semiconductor assembly is described. In accordance with one example of the invention, the semiconductor assembly comprises a semiconductor body, a top main electrode arranged on a top side, a bottom main electrode arranged on an underside, and a control electrode arranged on the top side. The semiconductor assembly further includes a spring element for the pressure contacting of the control electrode with a pressure force generated by the spring element.