Integrated Standard Cell Structure With Multilayer Power Rails
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Solution Overview
Problem
As semiconductor fabricating processes miniaturize, the integration degree and performance of integrated circuits designed with standard cells are compromised due to reduced pattern and cell sizes, necessitating improved electrical connections and layout enhancements.
Innovation Solution
The integrated circuit incorporates a plurality of wiring layers to electrically connect source contacts of transistors across standard cells, utilizing power rails and parallel wiring lines to enhance integration and reliability, with specific configurations of transistors and wiring layers to optimize electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If standard cell size is reduced to achieve miniaturization, then device density increases, but electrical connection reliability deteriorates
Solution Approach 1:
The patent transitions from planar single-layer wiring to three-dimensional multi-layer wiring structures. Wiring lines are arranged across multiple stacked layers with vertical vias connecting them, enabling complex interconnections while maintaining compact footprint. This dimensional expansion allows reliable electrical connections despite reduced cell dimensions.
Solution Approach 2:
The wiring structure implements nested arrangements where wiring lines in different layers are positioned to overlap or interlock vertically. Power rails and signal lines are nested within the multi-layer structure, with lower layers providing foundational connections and upper layers adding functional complexity, achieving high integration density with maintained reliability.
2Quantity of substance
If standard cell size is reduced, then integration degree increases, but manufacturing complexity increases
Solution Approach 1:
The wiring structure is segmented into multiple discrete layers, each performing specific functions. Power rails, signal lines, and ground connections are separated into different layers, allowing independent optimization and simplified manufacturing processes for each layer while achieving high overall integration.
Solution Approach 2:
The multi-layer wiring structure serves multiple functions simultaneously: power distribution, signal routing, and grounding. The same layered architecture supports both dense integration and simplified manufacturing by providing universal structural templates that can be replicated across different cell types.
3Reliability
If wiring layers are increased to improve connectivity, then electrical connection reliability improves, but device complexity increases
Solution Approach 1:
Multiple wiring functions are merged into the standardized multi-layer structure. Power rails, signal lines, and control connections are combined in a systematic layered arrangement where each layer type serves its purpose while contributing to overall reliability. The standardized structure reduces the effective complexity despite the increased number of layers.
Data Source
AI summary
An integrated circuit includes a first standard cell including a first first-type transistor, a first second-type transistor, a third second-type transistor, and a third first-type transistor, a second standard cell including a second first-type transistor, a second second-type transistor, a fourth second-type transistor and a fourth first-type transistor, a plurality of wiring layers which are disposed on the first and second standard cells and includes a first wiring layer, a second wiring layer, and a third wiring layer sequentially stacked. A source contact of the first first-type transistor and a source contact of the second first-type transistor are electrically connected through a first power rail of the plurality of wiring layers, and a source contact of the third first-type transistor and a source contact of the fourth first-type transistor are electrically connected through a second power rail of the plurality of wiring layers.