Integrated Stiffener Capacitor for Package Substrate
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Solution Overview
Problem
The challenge in electronic device packages is the increased XY dimensions due to locating decoupling capacitors and stiffeners on the same side, which leads to larger footprints and Z dimension limitations, resulting in higher costs and lower capacitance values for low profile capacitors.
Innovation Solution
A combination stiffener and capacitor is integrated into a single component, providing mechanical support and decoupling capacitance, eliminating the need for separate components and reducing package size by incorporating a structural material with electrodes forming a capacitor, thus addressing both dimensional and cost concerns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If decoupling capacitors and stiffeners are located on the same side of the package, then both mechanical support and decoupling capacitance are provided, but the XY footprint dimensions increase
Solution Approach 1:
The patent combines a stiffener and a decoupling capacitor into a single integrated component. The stiffener portion provides mechanical reinforcement to the package substrate, while the capacitor portion (with first and second electrodes) provides decoupling capacitance. This merging eliminates the need for separate stiffener and capacitor components, thereby reducing the overall XY footprint while maintaining both mechanical support and electrical decoupling functions.
Solution Approach 2:
The integrated component serves multiple functions simultaneously: the stiffener portion provides structural support to minimize package warpage, while the capacitor portion provides decoupling capacitance for power delivery networks. This multi-functionality allows a single component to replace what would traditionally require two separate components, thus reducing the package footprint.
2Length of stationary object
If low profile capacitors are used to reduce Z height, then package height is reduced, but capacitance values decrease and costs increase
Solution Approach 1:
By integrating the capacitor function into the stiffener component, the design achieves better capacitance per unit area. The capacitor portion can be configured with optimal dimensions and electrode arrangements that are not constrained by the low-profile requirements, thereby achieving higher capacitance values without increasing the Z height of the overall package.
3Adaptability or versatility
If separate stiffener and capacitor components are used, then design flexibility is maintained, but package complexity and cost increase
Solution Approach 1:
The integration of stiffener and capacitor into a single component reduces the number of discrete parts, simplifying the bill of materials and assembly process. This merging reduces package complexity and associated costs while maintaining design flexibility through the ability to configure the integrated component with different electrode arrangements, dielectric materials, and stiffener geometries to meet specific electrical and mechanical requirements.
Data Source
AI summary
Electronic device package stiffener and capacitor technology is disclosed. A combination stiffener and capacitor can include a structural material configured to be coupled to a substrate. The structural material can have a shape configured to provide mechanical support for the substrate. The combination stiffener and capacitor can also include first and second electrodes forming a capacitor. An electronic device package and a package substrate configured to receive the combination stiffener and capacitor are also disclosed.