Integrated Strain Gauge in Component Carrier Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing component carrier manufacturing methods lack simplicity and additional functionality, particularly in integrating strain gauges for accurate strain detection without compromising the robustness and accuracy of measurements.
Innovation Solution
A component carrier is designed with an integrated strain gauge formed from an interconnected stack of electrically conductive and insulating layer structures, allowing for precise strain detection without the need for separate strain gauge attachments, using materials and processes like printing conductive ink or laminating electrically conductive layers, which enhances detection accuracy and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a separate strain gauge is attached to the component carrier, then strain detection functionality is added, but manufacturing complexity increases and detection accuracy may be compromised due to delamination or material mismatches
Solution Approach 1:
The strain gauge is merged with the component carrier by forming it as an integrated conductive layer within the interconnected stack of conductive and insulating layers. This eliminates the need for separate strain gauge attachments and their associated mounting materials, thereby reducing manufacturing complexity while ensuring consistent strain detection accuracy through direct integration with the carrier structure.
2Measurement precision
If an interconnected stack of multiple layers is used to form the strain gauge, then detection accuracy and flexibility are improved, but manufacturing steps increase
Solution Approach 1:
The interconnected stack of conductive and insulating layers serves multiple functions simultaneously: it provides the structural framework of the component carrier, establishes electrical connections, and forms the strain-sensitive conductive paths. This multi-functionality allows the same manufacturing process to achieve both structural integrity and strain detection capability without adding separate manufacturing steps.
Solution Approach 2:
The strain gauge conductive paths are formed as part of the initial layer stack construction process, before the component carrier is fully assembled and before any strain measurement is required. The conductive layers are patterned and interconnected during the same manufacturing sequence that builds the carrier structure, eliminating subsequent assembly steps.
3Reliability
If conventional strain gauge attachment methods are used, then additional materials are required, but this increases the risk of delamination and reduces measurement robustness
Solution Approach 1:
The strain gauge is merged with the component carrier by forming it as an integrated conductive layer within the interconnected stack of conductive and insulating layers. This eliminates the need for separate strain gauge attachments and their associated mounting materials, thereby reducing manufacturing complexity while ensuring consistent strain detection accuracy through direct integration with the carrier structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated strain gauge provides high detection accuracy and flexibility, preventing delamination and reducing material usage, allowing for precise strain measurement at specific points of interest with increased robustness and reduced manufacturing complexity.
Implementation Method 1
at least part of at least one of the electrically conductive layer structures is configured as at least part of an integrated strain gauge configured for detecting strain exerted on at least part of the component carrier
Data Source
AI summary
A component carrier for carrying an electronic component on and/or in the component carrier, wherein the component carrier includes an interconnected stack composed of a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures, wherein at least part of at least one of the electrically conductive layer structures is configured as at least part of an integrated strain gauge configured for detecting strain exerted on at least part of the component carrier.