Integrated Substrate Bonding for Narrow Display Frame Width
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Solution Overview
Problem
Existing display devices face challenges in reducing the frame width and manufacturing costs due to the need for multiple wiring substrates and complex connections, which can lead to increased complexity and potential short circuits.
Innovation Solution
The design incorporates a first and second substrate with a sealing material and contact holes that allow for direct electrical connection between conductive layers without the need for additional wiring substrates, using a connecting material that fills the contact holes to ensure reliable contact and reduce the frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional wiring substrates are used to connect conductive layers, then electrical connection is achieved, but device complexity and frame width increase
Solution Approach 1:
The patent merges the function of separate wiring substrates into a single integrated substrate structure. The first and second substrates are bonded directly to each other with conductive layers formed on their inner surfaces, eliminating the need for additional wiring substrates while maintaining electrical connection functionality.
Solution Approach 2:
The patent extracts and removes the unnecessary additional wiring substrates from the conventional multi-substrate structure. By forming conductive layers directly on the inner surfaces of the first and second substrates and bonding them together, the design eliminates redundant components while achieving the required electrical connections.
2Reliability
If additional wiring substrates are used to connect conductive layers, then electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple separate wiring substrates into a single integrated substrate structure where conductive layers are formed directly on the inner surfaces of the first and second substrates. This reduction in component count directly lowers manufacturing costs while maintaining electrical connection reliability.
3Length of moving object
If frame width is reduced for narrower display device, then device size is improved, but connection reliability may worsen
Solution Approach 1:
The patent merges the first and second substrates into a closely integrated structure with direct bonding, eliminating the need for additional wiring substrates that would occupy space. This allows for reduced frame width while maintaining connection reliability through the direct substrate-to-substrate bonding interface.
Data Source
AI summary
According to one embodiment, an electronic device includes a first substrate including a first basement and a first conductive layer, a second substrate including a second basement opposed to the first basement and the first conductive layer, and a second conductive layer, a sealing material located between the first substrate and the second substrate to bond the first substrate to the second substrate, a contact hole penetrating the second basement, the sealing material and the first conductive layer, and a connecting material electrically connecting the first conductive layer with the second conductive layer via the contact hole.