Integrated Substrate Cleaning Apparatus for Semiconductor Wafers

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current substrate cleaning technologies for semiconductor wafers and LCD substrates before immersion exposure are inefficient, as they require separate cleaning units for the top surface, bevel portion, and back surface, leading to increased space requirements and reduced throughput, and fail to effectively clean hydrophobic areas.

Innovation Solution

A compact cleaning apparatus that integrates a first substrate holding portion for the back surface, a second substrate holding portion for rotating the substrate, top surface cleaning nozzles, bevel cleaning nozzles, and back surface cleaning fluids, allowing simultaneous cleaning of the top surface, bevel portion, and back surface without the need for a reverser, thus reducing space and increasing throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate cleaning units are used for top surface, bevel portion, and back surface, then each area can be cleaned independently, but the apparatus occupies large space and reduces production throughput

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidapparatus footprint

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple cleaning units (top surface cleaning unit, bevel portion cleaning unit, and back surface cleaning unit) into a single integrated cleaning apparatus. The substrate holding portion can rotate the substrate to present different surfaces to respective cleaning nozzles, allowing all cleaning operations to be performed in one compact device rather than requiring separate standalone units for each surface.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate holding portion serves multiple functions: it holds the substrate, rotates the substrate to different orientations, and positions the substrate for cleaning of top surface, bevel portion, and back surface sequentially. This multi-functional component eliminates the need for separate handling and positioning mechanisms that would be required if separate cleaning units were used.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If separate cleaning units are used for top surface, bevel portion, and back surface, then each area can be cleaned independently, but substrate transfer time increases and productivity decreases

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidproduction throughput

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The cleaning apparatus enables continuous cleaning operations by rotating the substrate during the cleaning process. The substrate is held by the substrate holding portion, rotated to present different surfaces to cleaning nozzles, and cleaned sequentially without requiring removal or repositioning between cleaning zones. This continuous rotation and cleaning process eliminates idle transfer time between separate cleaning units.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The substrate holding portion introduces dynamic rotation capability, allowing the substrate to be actively rotated during the cleaning process to present different surfaces to the cleaning nozzles. This dynamic positioning enables all cleaning operations to be performed in a single integrated sequence rather than requiring static, separate cleaning stations with transfer steps in between.

Inventive Principle:

Principle #15Dynamics

3Ease of manufacture

If conventional cleaning methods are used, then hydrophobic areas may be cleaned, but particle contamination and wafer warpage still occur due to insufficient cleaning effectiveness

Engineering Contradiction:

Improvecleaning process simplicityVSAvoidparticle contamination

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The cleaning apparatus divides the cleaning function into three separate cleaning units, each dedicated to a specific surface area: top surface cleaning unit, bevel portion cleaning unit, and back surface cleaning unit. Each unit can be optimized with appropriate cleaning nozzles and parameters for its specific target area, ensuring thorough cleaning of hydrophobic regions and complete particle removal from all surfaces, thereby preventing contamination and warpage.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS9120120B2Cleaning apparatus and cleaning method, coater/developer and coating and developing method, and computer readable storing medium

Publication Date: 2015.09.01 TOKYO ELECTRON LTD

AI summary

A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.