Integrated Heat Dissipation Substrate With Internal Coolant Channels
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Solution Overview
Problem
Existing heat dissipation substrates for high-power semiconductor devices face challenges in efficiently integrating heat dissipation devices without damaging the circuit board's synthetic resin insulating layer, and in achieving sufficient heat conduction while avoiding circuit defects.
Innovation Solution
A manufacturing method for a heat dissipation device-integrated heat dissipation substrate that involves preparing overlapping metal base plates with a three-dimensional structure for a heat media circulation space, coupling these plates via brazing, and bonding an electrode metal plate with a groove pattern to the integrated base using insulating resin, thereby forming a heat dissipation device-integrated base without damaging the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation devices are separately attached to the printed circuit board, then heat dissipation effect is improved, but heat conduction resistance at coupling surface increases and circuit defects occur
Solution Approach 1:
The patent integrates the heat dissipation device directly into the printed circuit board structure by forming a through-hole that penetrates the entire board thickness, allowing the heat dissipation device to be coupled with the electrode layer internally rather than being separately attached externally. This merging eliminates the coupling surface heat conduction resistance problem while maintaining effective heat dissipation.
2Temperature
If brazing is used to bond the water jacket to the printed circuit board, then heat dissipation is improved, but the synthetic resin insulating layer is damaged due to high process temperature
Solution Approach 1:
The patent extracts the heat dissipation device coupling process from the external surface bonding method and relocates it to the internal through-hole structure. By positioning the water jacket within the through-hole and bonding it to the electrode layer rather than the outer board surface, the high-temperature brazing process no longer directly exposes the synthetic resin insulating layer, thus preventing damage while achieving effective heat dissipation.
3Power
If high-power semiconductor devices are mounted, then device functionality is improved, but heat generation increases causing malfunction and reliability problems
Solution Approach 1:
The patent merges the heat dissipation function directly into the printed circuit board's internal structure by integrating the water jacket within the through-hole that penetrates the board. This internal integration creates a direct thermal coupling path from the high-power semiconductor devices through the electrode layer to the heat dissipation device, enabling effective heat removal and maintaining device reliability under high-power operation conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient integration of heat dissipation devices like water jackets or heat pipes on the rear surface of printed circuit boards without damaging the synthetic resin insulating layer, ensuring effective heat dissipation and preventing circuit defects.
Implementation Method 1
a metal base integrated with a heat media circulation space for absorbing and dissipating heat transferred from the plurality of electrodes
Implementation Method 2
a base coupling step of coupling opposing inner surfaces of the first base and the second base against each other
Data Source
Figure 1~2(b)
Figure 3(a)~5
Figure 6~7
AI summary
A manufacturing method of a heat dissipation device-integrated heat dissipation substrate for a semiconductor includes a base processing step of preparing a first base plate and a second base plate in the form of metal plates that overlap each other and constitute a part of a metal base, and providing a first base and a second base in which a three-dimensional structure forming the heat media circulation space is formed on an inner surface of at least one of the first base plate and the second base plate, a base coupling step of coupling opposing inner surfaces of the first base and the second base against each other to form heat dissipation device-integrated base, an electrode metal plate preparation step of processing an electrode metal plate to form a groove pattern, and preparing an electrode metal plate configured to cover an area corresponding to at least one circuit unit, and an electrode metal plate bonding step of bonding, via insulating resin, the electrode metal plate to an upper surface of the heat dissipation device-integrated base.