Integrated Substrate Heat Conduction for Electronic Cooling
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Solution Overview
Problem
Current heat conduction solutions in electronic equipment are inefficient due to multiple interfaces between electric components and thermal substance circulation systems, leading to reduced cooling effectiveness and potential overheating.
Innovation Solution
A substrate with integrated heat conductive properties and connectors for the thermal substance circulation system, eliminating extra interfaces by being in direct contact with both the electric components and the circulation system, thereby facilitating efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple interfaces are used between electric components and thermal substance circulation system, then connection flexibility is improved, but heat conduction efficiency deteriorates due to increased thermal resistance
Solution Approach 1:
The patent merges the substrate and heat dissipation structure into a single integrated component. The substrate directly contacts both the electric component and the thermal substance circulation system, eliminating intermediate interfaces. This integration reduces thermal resistance while maintaining connection flexibility through the unified design.
2Adaptability or versatility
If multiple intermediate structures are used for heat transfer, then system adaptability is improved, but thermal resistance increases reducing cooling effectiveness
Solution Approach 1:
The substrate serves as both the mounting platform for electric components and the heat dissipation structure. By combining these functions into one component, the patent eliminates intermediate heat transfer structures, thereby reducing thermal resistance and energy loss while maintaining system adaptability.
3Reliability
If direct contact between substrate and thermal substance circulation system is implemented, then heat conduction efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The integrated substrate design combines mounting and heat dissipation functions in a single component that can be manufactured as one piece. This approach improves heat conduction efficiency through direct contact while actually simplifying manufacturing by reducing the number of separate parts and assembly steps required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a sophisticated and effective heat conduction method that enhances cooling efficiency by minimizing thermal resistance, allowing for better performance and reduced risk of overheating in electronic equipment.
Implementation Method 1
the substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system
Data Source
AI summary
An apparatus for conducting heat, including a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate includes a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a second part of the thermal substance circulation system such that the substrate is, when in use, in contact with the thermal substance of the circulation system between the first and the second interface. The substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system.