Integrated Substrate Heat Dissipation for RF Modules
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Solution Overview
Problem
Current heat dissipation devices for communication devices face inefficiencies due to increased thermal contact resistance from external heat pipes, which hinder improved heat dissipation efficiency.
Innovation Solution
A heat dissipation device with hollow conduits inside the substrate, forming evaporating and condensing conduits that vaporize and condense liquid to transfer heat, reducing thermal contact resistance and enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an external heat pipe assembly is added to assist heat dissipation, then heat dissipation capability is improved, but thermal contact resistance increases
Solution Approach 1:
The patent integrates the heat pipe assembly with the substrate by forming the heat dissipation fins directly on the substrate surface, merging the previously separate components into a unified structure. This eliminates the need for additional external heat pipe assemblies while maintaining effective thermal coupling between the heating element and heat dissipation structure.
Solution Approach 2:
The patent extracts the heat pipe functionality from a separate external assembly and integrates it directly into the substrate structure. By forming heat dissipation fins directly on the substrate, the design removes the thermal contact resistance interface that existed between external heat pipes and the substrate, while preserving the heat pipe's heat dissipation function.
2Temperature
If heat dissipation fins are formed on the substrate, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines the substrate and heat dissipation fins into a single integrated structure. The heat dissipation fins are formed directly on the substrate surface, eliminating the need for separate heat dissipation components and reducing overall device complexity while maintaining effective heat dissipation.
Solution Approach 2:
The substrate serves multiple functions: it provides structural support, electrical connectivity, and heat dissipation. By integrating heat dissipation fins directly into the substrate, the substrate becomes a multi-functional component that eliminates the need for dedicated heat dissipation structures, thereby reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves heat dissipation efficiency by minimizing thermal contact resistance and maintaining a lightweight, compact design suitable for miniaturized RF modules.
Implementation Method 1
a sealed conduit is formed by the evaporating conduits and the condensing conduits, and is filled with liquid which vaporizes upon heating
Implementation Method 2
the condensing conduits and the evaporating conduits form a sealed conduit, and the sealed conduit is filled with liquid which vaporizes upon heating
Implementation Method 3
the heat absorbing surface 5 is on the other side of the substrate 1... when the heating elements conduct heat from the heat absorbing faces 5 to the whole substrate 1
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1).