Integrated Switch Module for Arc-Free DC Circuit Protection

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Solution Overview

Problem

Existing electromechanical circuit breakers, such as miniature circuit breakers, face challenges in efficiently extinguishing electrical arcs and dissipating heat in direct current systems, necessitating a transition to semiconductor-based devices while maintaining compatibility with existing installations and housing sizes.

Innovation Solution

An electrical protection system incorporating semiconductor power switches with integrated heat dissipation plates, housed in a compact enclosure, utilizing the space freed by omitting conventional components, and synchronized with a switching mechanism to prevent arc formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a breaking chamber with metal plates is used to extinguish electrical arcs, then arc extinction performance is improved, but device complexity and size increase

Engineering Contradiction:
Improvearc extinction performanceVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and removes the breaking chamber with metal plates from the circuit breaker structure, replacing it with an electronic breaking device using semiconductor components. This eliminates the complex mechanical arc extinction mechanism while achieving faster and more reliable arc extinction through electronic switching.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical breaking chamber system with an electronic solid-state switching system. The semiconductor-based electronic breaking device substitutes the mechanical metal plate structure, achieving arc extinction through electronic control rather than mechanical means, thereby reducing device complexity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Speed

If semiconductor power switches are used to improve reaction time, then speed of current interruption is improved, but heat generation increases

Engineering Contradiction:
Improvereaction timeVSAvoidheat generation
Core Design Contradiction:
SpeedVSTemperature

Solution Approach 1:

The patent introduces a heat dissipation plate as an intermediary thermal management component between the semiconductor power switches and the environment. This plate efficiently conducts and dissipates the heat generated by the high-speed switching operations, enabling fast current interruption while controlling temperature rise.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the thermal parameters of the device by implementing an optimized heat dissipation structure. The heat dissipation plate modifies the thermal conduction path and increases surface area for heat release, allowing the semiconductor switches to operate at high speed while maintaining acceptable temperature levels.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If the housing size is reduced to maintain compatibility with existing installations, then adaptability is improved, but space for heat dissipation components is reduced

Engineering Contradiction:
Improvecompatibility with existing installationsVSAvoidspace for heat dissipation
Core Design Contradiction:
Adaptability or versatilityVSVolume of stationary object

Solution Approach 1:

The patent merges the heat dissipation function with the housing structure itself. The housing is designed to serve dual purposes: as the protective enclosure and as part of the heat dissipation path. This integration eliminates the need for separate, space-consuming heat dissipation components, allowing compact housing while maintaining effective thermal management.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements multi-functionality in the housing design, where the housing structure simultaneously provides mechanical protection, structural support, and thermal management functions. This universal design allows the device to maintain compatibility with existing installations while incorporating adequate heat dissipation capabilities within the constrained volume.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively interrupts high currents with fast reaction times, safely extinguishes arcs, and dissipates heat, ensuring compatibility with existing installations and reducing the need for solid-state components.

Implementation Method 1

the power switch or each power switch comprising a metal heat dissipation plate connected to an electrode of said power switch, said heat dissipation plate being thermally connected to the body of said power switch

Methodology Applied
Scientific EffectHeat dissipation: Conduction (thermal)

Data Source

PatentEP4341973B1Electrical protection devices and systems with an integrated switch module
Publication Date: 2026.03.11 SCHNEIDER ELECTRIC IND SAS
  • EP4341973B1 patent drawingFigure 1
  • EP4341973B1 patent drawingFigure 2
  • EP4341973B1 patent drawingFigure 3

AI summary

An electrical protection system (2) has a housing (4), connecting terminals (6, 8), separable electrical contacts (10), a switching mechanism (12) and at least one power switch (22) connected in series with the separable electrical contacts, wherein the system further comprises an electronic control circuit (24) coupled to the at least one power switch, the or each power switch has a metallic heat dissipation plate (86) connected to an electrode of said power switch, said heat dissipation plate being thermally connected to the body of the power switch, and wherein the or each power switch is connected in series with the separable electrical contacts between the connecting terminals via a conductive plate (90, 92) connected to the heat dissipation plate of the respective power switch.