Integrated Test Socket Layout for Low-Noise Burn-In Signal Transfer
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Solution Overview
Problem
Conventional burn-in tests for semiconductor components face issues with analog signal attenuation and noise interference due to signal transmission through connectors and multiple boards, leading to detection failures and complex wiring, and a large overall structure.
Innovation Solution
A test device with an integrated test socket and control module, including a control unit and memory unit, that converts analog signals to digital signals internally and transmits them via a digital signal bus, reducing interference and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If analog signal transmission is used through connectors and multiple boards, then the test device can be constructed with separate components, but the analog signal is prone to attenuation and noise interference causing detection failure
Solution Approach 1:
The patent integrates the control unit and memory unit directly into the test socket, eliminating the need for separate daughter boards and complex wiring. The control unit includes an A/D converter that directly converts analog signals to digital signals at the source, merging multiple functions into a single integrated module that improves signal reliability while reducing wiring complexity.
Solution Approach 2:
The patent replaces the mechanical/electrical analog signal transmission system with a digital signal processing system. By integrating an A/D converter in the control unit, analog signals are converted to digital signals at the test socket, eliminating the problems of analog signal attenuation and noise interference during transmission through connectors and boards.
2Ease of manufacture
If the burn-in test socket, control unit and memory unit are connected individually to the daughter board and mother board, then the components can be separately manufactured, but the overall structure becomes too large and wiring becomes complicated
Solution Approach 1:
The control unit and memory unit are integrated into the test socket as a single module, eliminating the need for separate daughter boards and reducing the overall device volume. The integrated design maintains ease of manufacture by using standard integrated circuit techniques while significantly compacting the structure.
3Ease of manufacture
If the burn-in test socket, control unit and memory unit are connected individually to the daughter board and mother board, then the components can be separately manufactured, but the wiring of the daughter board and mother board becomes complicated
Solution Approach 1:
By integrating the control unit and memory unit into the test socket, the patent eliminates complex wiring between multiple separate components. The integrated module requires only simple connections to the mother board, dramatically reducing wiring complexity while maintaining ease of manufacture through standardized integration techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated solution minimizes signal attenuation and noise interference, simplifies circuit board wiring, increases layout space, and reduces the overall structure size by eliminating individual connections to daughter and mother boards.
Implementation Method 1
the control unit is combined with an analog-to-digital signal conversion unit to directly convert an analog signal of the sensing signal into a digital signal
Data Source
AI summary
A test device including a test socket and a control module is provided. The test socket has a base and a cover and is used to carry an object to be tested, and the control module is integrated on the test socket and is electrically connected to the test socket and includes a control unit and a memory unit. The test device integrates a test socket and a control module to reduce the attenuation of the analog signal and increase the layout space of the circuit board.