Integrated Test Structure for On-Line Passivation Undercut Detection
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Solution Overview
Problem
The manufacturing process of liquid crystal panels is hindered by passivation undercut during the etching of via holes, leading to abnormal displays and quality issues, with current off-line detection methods being labor-intensive and time-consuming, increasing manufacturing costs.
Innovation Solution
A substrate with integrated test structures that allow for on-line detection of passivation undercut by forming second via holes and transparent electrodes in a test area, enabling real-time resistance testing to reflect the passivation undercut condition of first via holes, thus eliminating the need for off-line detection and reducing labor and time costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If off-line detection is used to monitor passivation undercut, then detection capability is provided, but labor cost and time consumption increase
Solution Approach 1:
The patent merges the test area with the display substrate area to form an integrated substrate. The test structures (second via holes, second transparent electrodes, conductors, and pads) are formed on the same substrate as the display structures, allowing detection to be performed on-line without separate sampling and off-line testing processes
Solution Approach 2:
The substrate itself provides the detection function through integrated test structures. The second via holes and second transparent electrodes form a test circuit that automatically reflects the passivation undercut condition, enabling the substrate to self-diagnose quality issues without external detection equipment or manual sampling
2Measurement precision
If off-line detection is used to monitor passivation undercut, then detection capability is provided, but manufacturing cost increases
Solution Approach 1:
The test structures are merged with the display substrate manufacturing process. The second via holes, second transparent electrodes, conductors, and pads are formed using the same manufacturing procedures as the display structures, eliminating the need for separate detection equipment and reducing manufacturing costs
Solution Approach 2:
The manufacturing process achieves multi-functionality by simultaneously creating both display structures and test structures. The same etching, deposition, and patterning processes serve both the functional display areas and the integrated test areas, maximizing resource utilization and reducing costs
3Productivity
If on-line detection is implemented through integrated test structures, then detection speed and efficiency improve, but substrate structure complexity increases
Solution Approach 1:
The test structures are localized to specific regions (test areas) on the substrate, distinct from the display substrate areas. This local concentration of test elements minimizes the impact on overall substrate design while enabling efficient on-line detection
Solution Approach 2:
The test structures are simplified copies of the display structures. The second via holes, second transparent electrodes, conductors, and pads replicate the basic functional elements needed for detection, using the same manufacturing processes but serving only the detection function, thus reducing design complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for timely detection of passivation undercut, reducing scrapping rates and manufacturing costs, while improving production efficiency by enabling on-line detection before substrates are cut, thus ensuring higher quality liquid crystal panels.
Implementation Method 1
first transparent electrodes disposed on the insulating layer of the display substrate area and in the first via holes and connected with the metal layer; and second transparent electrodes disposed in the second via holes and connected with the metal layer
Data Source
AI summary
The present application discloses a test structure, a substrate and a method for manufacturing the substrate. The substrate includes a stacked substratum, a metal layer and an insulating layer; first via holes and second via holes disposed in different areas and passing through the insulating layer, and first transparent electrodes and second transparent electrodes disposed in different via holes and connected with the metal layer. The first via holes and the second via holes are formed through the same manufacture procedure, and the first transparent electrodes and the second transparent electrodes are formed through the same manufacture procedure.


