Integrated Thermal Sensor and Heater Assembly for Nanoscale Calibration
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Solution Overview
Problem
Existing miniature thermal sensing devices, such as thermocouples and thermistors, face challenges in accurately measuring temperature at the nanoscale due to estimation errors from resistance changes in bulk heaters, which do not accurately represent surface temperatures and can be unstable during heating processes.
Innovation Solution
An integrated thermal sensor and heater assembly is developed, where a thermocouple or thermistor is placed directly above a micro heater source on a single crystal silicon wafer, with the heater defined by ion implantation or thin film resistors, and an insulating layer isolates the sensing element, allowing for direct and accurate temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If resistance changes in bulk heaters are used to estimate temperature, then temperature measurement is possible, but measurement precision deteriorates due to estimation errors and instability
Solution Approach 1:
A thermocouple is introduced as an intermediary sensing element positioned between the bulk heater and the measurement system. The thermocouple directly contacts the heater surface and provides accurate temperature readings without relying on resistance change estimations, thereby resolving the measurement precision and reliability issues
Solution Approach 2:
The temperature sensing function is extracted from the bulk heater structure itself and implemented as a separate thermocouple element. This separation allows the heater to focus on heating while the thermocouple provides accurate, independent temperature measurement, eliminating the estimation errors inherent in using resistance changes
2Measurement precision
If a thermocouple is placed directly on the heater surface, then measurement precision improves, but device complexity increases due to integration requirements
Solution Approach 1:
The thermocouple and heater are merged into a single integrated assembly where the thermocouple is positioned directly on the heater surface and both are supported by a common substrate. This merging simplifies the overall device structure while maintaining measurement precision, as the components work together as a unified system rather than separate elements
Solution Approach 2:
The integrated assembly uses homogeneous materials and structures throughout, with the thermocouple, heater, and support substrate forming a uniform integrated unit. This homogeneity reduces manufacturing complexity and ensures consistent thermal and electrical properties across the device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design provides precise and controlled local heating with minimal temperature differential, enabling accurate calibration of miniature thermal sensing devices for applications like scanning thermal microscopy, ensuring stable measurements even at high temperatures.
Implementation Method 1
the heater defined using an ion implantation process... the dose and energy of the ion beam determines the resistance of the heater
Implementation Method 2
sensing element such as a metal thermocouple or thermistor placed directly above and in contact with the micro heater source
Implementation Method 3
the heater may be defined using an ion implantation process... the dose and energy of the ion beam determines the resistance of the heater
Data Source
AI summary
A calibration device including a thermal sensing device, and a reference heater, where the heater and the sensing device are integrated together, the heater and the sensing have at least one dimension substantially in common, and the over all dimensions are in the range of thermal micro probes, 100 nm-500 microns.