Integrated Thermal and Shielding Layer for Electronic Device Heat Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic devices using ultra-high frequency bands face challenges in noise shielding and heat radiation, leading to increased volume and compromised noise shielding performance due to the use of separate shield cans and Thermal Interface Materials.
Innovation Solution
An electronic device with a heat radiating structure that integrates noise shielding and heat radiation using a thermal conductive layer and an electrical conductive layer, where the thermal conductive layer is attached to the electronic component and extends towards a middle plate, and the electrical conductive layer provides electromagnetic shielding, eliminating the need for a separate shield can and allowing for flexible component placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate shield can and Thermal Interface Material (TIM) are used for heat radiation, then heat radiation performance is improved, but device volume increases
Solution Approach 1:
The patent combines the shield can and Thermal Interface Material (TIM) into a single integrated structure. The shield can includes a bottom plate with a recess that receives the TIM, allowing the shielding function and heat radiation function to be performed by one combined component rather than separate parts, thereby reducing device volume while maintaining both noise shielding and heat radiation performance
Solution Approach 2:
The shield can is designed to perform multiple functions simultaneously: it provides electromagnetic noise shielding through its conductive structure, and it provides heat radiation through the TIM applied to its inner surface. This multi-functional design eliminates the need for separate components for each function, reducing overall device volume
2Temperature
If the shield can is at least partially punctured to apply TIM, then heat radiation is improved, but noise shielding performance deteriorates
Solution Approach 1:
The shield can's bottom plate is divided into two functional regions: a solid portion that provides noise shielding, and a recessed portion that accommodates the TIM for heat radiation. This segmentation allows both noise shielding and heat radiation to be achieved without compromising either function, as the TIM is contained within the recess rather than requiring punctures through the shielding structure
Solution Approach 2:
The TIM is nested within the recess of the shield can's bottom plate, allowing the TIM to be positioned in contact with the electronic component while the surrounding solid structure of the shield can maintains continuous noise shielding. The TIM is effectively 'nested' within the shielding structure rather than requiring the shielding structure to be disrupted
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively secures mounting space and enhances noise shielding and heat radiation performance while maintaining component flexibility, reducing device volume and improving assembly properties.
Implementation Method 1
a first thermal conductive layer (510) having a first portion (P1) attached to the first surface or the second surface, and a second portion (P2) extending from the first portion (P1) toward the middle plate (231)
Implementation Method 2
a second electrical conductive layer (520) having a third portion (P3) attached to the first portion (P1) so that the third portion (P3) constructs an electromagnetic shielding structure for the second electronic component (490)
Data Source
AI summary
According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.