Integrated Thermistor Carrier for Semiconductor Thermal Management
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Solution Overview
Problem
Conventional semiconductor devices face challenges in accurately measuring the temperature of power semiconductors due to indirect thermal measurement methods, leading to performance losses and increased size, especially in high-power applications like LEDs and IGBTs, where derating occurs at critical temperatures, resulting in reduced service life and inefficient heat dissipation.
Innovation Solution
A semiconductor device with a carrier body integrated thermistor sensor structure, monolithically manufactured with a ceramic body, allowing for direct temperature measurement along the heat dissipation path between the semiconductor component and the heat sink, reducing thermal resistance and space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is applied next to power semiconductors on a common carrier, then temperature measurement is enabled, but thermal resistance increases and measurement precision deteriorates
Solution Approach 1:
The temperature sensor is integrated directly into the carrier body, merging the sensing function with the structural component. This eliminates separate sensor mounting interfaces and reduces thermal resistance by creating a monolithic structure where the sensor is inherently part of the heat dissipation path.
Solution Approach 2:
The carrier body acts as an intermediary that directly conducts heat from the power semiconductor to the temperature sensor. By making the carrier body itself the thermal conduction path rather than relying on separate sensor mounting structures, the system achieves better thermal coupling and measurement accuracy.
2Ease of manufacture
If multiple components and materials are arranged between power semiconductor and heat sink, then assembly is simplified, but thermal resistance increases and heat dissipation performance deteriorates
Solution Approach 1:
The carrier body merges multiple functions into a single component: it provides mechanical support, electrical isolation, and thermal conduction. This integration reduces the number of separate components and materials in the heat dissipation path while maintaining ease of assembly through the unified structure.
Solution Approach 2:
The carrier body utilizes composite material properties to achieve both electrical insulation and thermal conduction simultaneously. This allows the single component to replace multiple separate materials (insulators, thermal interfaces, structural elements) that would otherwise be stacked between the semiconductor and heat sink.
3Manufacturing precision
If temperature sensor and power semiconductors are placed on separate locations, then space requirements increase, but manufacturing precision requirements are reduced
Solution Approach 1:
The temperature sensor and power semiconductor are merged into a single integrated assembly where the sensor is built into the carrier body. This eliminates the need for separate mounting locations and complex alignment procedures, as the sensor is inherently positioned at the correct location through the monolithic manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise temperature measurement of semiconductor components with a temperature difference of less than 3 K/W, improving heat dissipation and reducing overall size, thus enhancing performance and extending the service life while maintaining high thermal conductivity and mechanical stability.
Implementation Method 1
The carrier body has a thermistor sensor structure (3) integrated into the carrier body (14), which is provided and set up to enable a temperature measurement via a change in resistance
Implementation Method 2
The carrier body has a ceramic body (4) which is in direct connection with the thermistor sensor structure (3)
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
The invention relates to a semiconductor device comprising a semiconductor component (7) on a support body (14), which comprises a ceramic body (4) and a thermistor sensor structure (14) which is integrated in the support body (14) and which is in direct contact with the ceramic body (4), and a heat sink (1) on which support body (14) is mounted.