Integrated Thermocouple Junctions for In-Chip Temperature Monitoring
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Solution Overview
Problem
There is a need for an integrated temperature monitoring system, including a thermocouple and associated temperature measurement circuitry, both integrated in an IC device, to monitor temperatures effectively and efficiently, particularly for high-performance transistors and processors, while minimizing cost and form factor.
Innovation Solution
An integrated thermocouple device is formed in an IC device, comprising a first metal component and a second metal component of different materials, defining thermocouple junctions, with monitoring circuitry to detect voltage and determine temperature data, and is constructed using a metal tub structure and monitoring circuitry integrated within the IC structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional thermocouple temperature monitoring system is used, then temperature monitoring capability is provided, but the system requires separate temperature sensor and measurement circuitry integration, increasing device complexity and form factor
Solution Approach 1:
The patent merges the thermocouple sensor structure directly into the IC device by forming the first and second metal components as integrated parts of the semiconductor device architecture. The thermocouple junctions are formed within the IC structure itself, eliminating the need for separate sensor components and reducing overall system complexity while maintaining temperature monitoring capability.
Solution Approach 2:
The metal components serve dual functions: they form both the thermocouple measurement junctions and integrate with the IC device structure. The first metal component forms junction elements and bridge structures that are simultaneously structural and functional parts of the semiconductor device, allowing one component to fulfill multiple roles in the system.
2Manufacturing precision
If additional mask operations are required for thermocouple integration, then precise thermocouple junction formation is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The thermocouple metal components are formed during the baseline IC manufacturing process steps, specifically during the metal interconnect formation steps. By performing the thermocouple structure creation as a preliminary action within the standard manufacturing sequence, the patent eliminates the need for separate post-processing mask operations while maintaining precise junction formation through the existing process control.
Solution Approach 2:
The same metal deposition and patterning processes used for creating IC interconnect structures are also used to form the thermocouple junctions. This universal approach allows the thermocouple components to be manufactured using the existing manufacturing infrastructure and process control, avoiding additional mask operations while achieving precise junction formation.
3Adaptability or versatility
If conventional separate sensor and circuitry design is used, then functional independence is maintained, but device form factor and cost increase
Solution Approach 1:
The patent combines the thermocouple sensor and measurement circuitry into a single integrated IC device. The thermocouple junctions are formed within the IC structure, and the measurement circuitry is integrated into the same chip, eliminating the need for separate sensor components and reducing the overall device form factor while maintaining functional independence through proper electrical isolation and signal routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated thermocouple device provides real-time temperature monitoring with a smaller form factor and lower cost, effectively detecting overheating conditions in IC devices like transistors without requiring additional mask operations in the baseline IC manufacturing process.
Implementation Method 1
A thermocouple produces a temperature-dependent voltage (also referred to as electromotive force (EMF)) as a result of the Seebeck effect
Data Source
AI summary
A system includes a metal tub structure formed in an integrated circuit (IC) structure, a first metal component, and a second metal component. The first metal component is formed from a first metal. The first metal component is formed in an opening defined by the metal tub structure, and includes a first metal first junction element, a first metal second junction element, and a first metal bridge electrically connected to the first metal first junction element and the first metal second junction element. The second metal component is formed from a second metal different than the first metal, and includes a second metal first junction element electrically connected to the first metal first junction element to define a first thermocouple junction, and a second metal second junction element electrically connected to the first metal second junction element to define a second thermocouple junction.