Integrated Thermoelectric Generator Core Temperature Sensing Assembly

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Solution Overview

Problem

Existing core temperature measurement systems face limitations in accuracy, sensitivity, and miniaturization due to reliance on bulk materials and discrete thermoelectric elements, leading to bulky devices with high response times and susceptibility to environmental factors.

Innovation Solution

A core temperature sensing assembly utilizing a thermoelectric generator as a heat flux sensor integrated into a circuit, which can actively heat or cool the object, and optionally includes a second thermoelectric generator with different thermal resistance, allowing for more accurate and sensitive measurements without the need for precise thermal resistance calculations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If discrete thermoelectric elements are used for heat flux sensing, then sensitivity can be achieved, but device size increases and miniaturization becomes difficult

Engineering Contradiction:
Improveheat flux sensing sensitivityVSAvoiddevice size
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The patent integrates multiple discrete thermoelectric elements into a single monolithic integrated circuit structure. The first and second thermoelectric generators are fabricated together on the same substrate using semiconductor processing techniques, merging what would traditionally be separate discrete components into one compact unit. This integration maintains the sensitivity benefits of multiple TEGs while eliminating the bulkiness of discrete packaging.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated circuit is divided into distinct functional regions with the first thermoelectric generator having a first configuration and the second thermoelectric generator having a second configuration. This segmentation allows each TEG to be optimized for specific thermal resistance characteristics while maintaining overall device miniaturization through shared fabrication processes and common substrate infrastructure.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If bulk materials of precise thermal resistance are used between temperature sensors, then measurement accuracy can be achieved, but device miniaturization becomes difficult

Engineering Contradiction:
Improvecore temperature measurement accuracyVSAvoiddevice size
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The patent replaces mechanical bulk material structures with a semiconductor-based integrated circuit approach. Instead of using physical bulk materials of precise thermal resistance, the invention uses integrated thermoelectric generators with controlled thermal pathways formed through semiconductor fabrication processes. This substitution enables miniaturization while maintaining measurement accuracy through precise control of thermal resistance at the micro-scale.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the scale of thermal resistance control from macroscopic bulk materials to microscopic integrated structures. By fabricating thermoelectric generators with specific configurations on a semiconductor substrate, the invention achieves precise thermal resistance values at a much smaller scale, enabling miniaturization while maintaining measurement precision.

Inventive Principle:
Principle #35Parameter changes

3Volume of moving object

If single heat flux systems are used, then device size can be reduced, but accuracy and sensitivity decrease

Engineering Contradiction:
Improvedevice sizeVSAvoidcore temperature measurement accuracy
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

The patent combines single heat flux sensing capability with dual heat flux measurement capability within a single integrated device. The first and second thermoelectric generators are integrated on the same substrate, allowing the device to perform both single-point sensing and differential heat flux measurement. This merging enables the device to maintain compact size while achieving the accuracy benefits of dual heat flux systems.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated circuit serves multiple functions: it acts as a single heat flux sensor, a dual heat flux sensor system, and provides temperature sensing capabilities. The first and second thermoelectric generators can be configured to work independently for single-point measurement or together for differential measurement, providing universal functionality that adapts to different measurement requirements while maintaining compact form factor.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides high sensitivity and accuracy while reducing device size and environmental susceptibility, enabling precise core temperature determination with a smaller footprint and improved performance compared to traditional systems.

Implementation Method 1

A heat flux sensor in the form of a thermoelectric generator

Methodology Applied
Scientific EffectSeebeck effect: Seebeck Effect

Implementation Method 2

the sensing assembly uses the thermoelectric generator to actively heat or cool the object

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS20240272015A1Sensing assembly
Publication Date: 2024.08.15 ANALOG DEVICES INT UNLTD CO
  • US20240272015A1 patent drawing
  • US20240272015A1 patent drawing
  • US20240272015A1 patent drawing

AI summary

The present disclosure provides a core temperature sensing assembly for measuring a core temperature of an object when positioned on a surface of the object. The sensing assembly uses a heat flux sensor in the form of a thermoelectric generator. The thermoelectric generator is provided as part of an integrated circuit. Alternatively or additionally, the sensing assembly uses the thermoelectric generator to actively heat or cool the object. Alternatively or additionally, the sensing assembly comprises a second heat flux sensor in the form of a thermoelectric generator, the first and second heat flux sensors having different thermal resistances determined by the configuration of the thermocouples.