Integrated Thermoelectric Modules for Aerospace De-icing

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Solution Overview

Problem

Current thermoelectric systems have low efficiencies and high costs due to discrete assembly processes, limiting their application and commercialization, particularly in aerospace de-icing systems where mechanical flexibility and efficiency are required.

Innovation Solution

A fully integrated thermoelectric module with a nanoscale polycrystalline microstructure is developed, using Skutterudite semiconductor elements and amorphous silica dielectric, integrated through liquid metalorganic deposition methods to enhance thermoelectric efficiencies and reduce manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If discrete assembly processes are used to manufacture thermoelectric systems, then manufacturing flexibility is maintained, but manufacturing cost increases and efficiency decreases

Engineering Contradiction:

Improvemanufacturing costVSAvoidmanufacturing efficiency

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The patent combines multiple discrete manufacturing steps into a single integrated liquid metalorganic deposition process, allowing simultaneous formation of substrates, semiconductor layers, and electrode structures. This merging of processes reduces the number of separate assembly operations, lowers manufacturing costs through consolidation, and improves overall production efficiency by eliminating intermediate handling and alignment steps.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The liquid metalorganic deposition process serves multiple functions simultaneously: it deposits semiconductor materials, forms conductive electrodes, creates insulating layers, and patterns structures all in one operation. This multi-functional approach replaces multiple specialized discrete manufacturing processes, reducing both cost and complexity while maintaining manufacturing flexibility.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If conventional thermoelectric modules are used, then basic de-icing function is provided, but thermoelectric efficiency remains low and cost is high

Engineering Contradiction:

Improvede-icing effectivenessVSAvoidthermoelectric efficiency

Core Design Contradiction:

ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent changes the fundamental parameters of thermoelectric material synthesis by using liquid metalorganic deposition to create nanoscale polycrystalline structures with controlled grain sizes and compositions. This produces materials with superior thermoelectric figures of merit compared to conventional bulk materials, achieving higher efficiency in converting electrical energy to thermal energy for de-icing applications.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention employs composite thermoelectric materials formed through liquid metalorganic deposition, combining multiple semiconductor compounds with optimized microstructures. These composite materials exhibit enhanced thermoelectric performance with higher efficiency, allowing effective de-icing with reduced energy consumption compared to conventional single-material modules.

Inventive Principle:

Principle #40Composite materials

3Adaptability or versatility

If thermoelectric systems are made mechanically flexible for aerospace applications, then adaptability to aerodynamic surfaces is improved, but structural integrity and reliability may be compromised

Engineering Contradiction:

Improvemechanical flexibilityVSAvoidstructural integrity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent fabricates thermoelectric modules as thin-film structures using liquid metalorganic deposition, creating flexible configurations that can conform to curved aerodynamic surfaces. These thin-film modules maintain structural integrity through controlled material deposition and nanoscale architecture, providing both the mechanical flexibility needed for aerospace applications and the reliability required for safe operation.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves higher thermoelectric figures of merit, enabling efficient heat transfer and conversion to electricity, suitable for aerospace de-icing and broader commercial applications, while reducing production costs and improving mechanical flexibility.

Implementation Method 1

integrated through liquid metalorganic deposition methods

Methodology Applied

Scientific EffectLiquid metalorganic deposition: Deposition (physical)

Implementation Method 2

Skutterudite semiconductor elements... enabling efficient heat transfer and conversion to electricity

Methodology Applied

Scientific EffectThermoelectric effect: Seebeck Effect

Implementation Method 3

amorphous silica dielectric... efficient heat transfer

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS10593855B2Fully integrated thermoelectric devices and their application to aerospace de-icing systems

Publication Date: 2020.03.17 DE ROCHEMONT L PIERRE

AI summary

A thermoelectric module and methods for making and applying same provide an integrated, layered structure comprising first and second, thermally conductive, surface volumes, each in thermal communication with a separate respective first and second electrically conductive patterned trace layers, and an array of n-type and p-type semiconducting elements embedded in amorphous silica dielectric and electrically connected between the first and second patterned trace layers forming a thermoelectric circuit.