Integrated Thyristor and PN Diode Chip for Compact Surge Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing surge protection devices, particularly those using thyristor-type devices like SIDACtors, face complexity in packaging due to the need for a lead frame to electrically couple multiple semiconductor chips, dissipate heat, and maintain a compact structure.
Innovation Solution
The integration of a thyristor-type device and a pair of PN diodes within a single semiconductor substrate, where the thyristor device extends from one main surface to the other, simplifies the packaging by eliminating the need for complex lead frames and allowing for a more compact and efficient protection device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are used to form a thyristor-type device and diodes, then the protection device can be formed with separate functional components, but the packaging complexity increases due to the need for a complex lead frame structure
Solution Approach 1:
The patent merges the thyristor-type device and diodes into a single integrated semiconductor chip structure, eliminating the need for multiple separate chips and their associated complex lead frame interconnections. This consolidation maintains functional separation while simplifying the overall packaging structure.
2Reliability
If a complex lead frame structure is used to electrically couple multiple semiconductor chips, then proper electrical connections and heat dissipation can be achieved, but manufacturing costs and device complexity increase
Solution Approach 1:
By integrating all active components onto a single semiconductor chip, the patent eliminates the need for a complex multi-chip lead frame assembly. The simplified lead frame only needs to connect to one chip, dramatically reducing structural complexity while maintaining reliable electrical connections and heat dissipation pathways.
3Adaptability or versatility
If multiple semiconductor chips are packaged together, then the protection device can provide comprehensive surge protection functionality, but the overall device size and packaging requirements increase
Solution Approach 1:
The patent combines multiple protection functions into a single integrated semiconductor chip containing the thyristor-type device and diodes. This integration dramatically reduces the package volume compared to multi-chip assemblies, as there is no need for spacing, bonding, and encapsulation of multiple separate components.
Data Source
AI summary
A protection device may include a semiconductor substrate and a thyristor-type device, formed within the semiconductor substrate, where the thyristor device extends from a first main surface of the semiconductor substrate to a second main surface of the semiconductor substrate. The protection device may include a first PN diode, formed within the semiconductor substrate; and a second PN diode, formed within the semiconductor substrate, wherein the thyristor-type device is arranged in electrical series between the first PN diode and the second PN diode.