Integrated ToF and VIS Pixel Array for Depth Sensing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing Time of Flight (ToF) sensors are expensive, bulky, and susceptible to interference, with limitations in spatial resolution, low-light sensitivity, and inability to collect visible-light color images, making them less effective in applications like autonomous vehicles.
Innovation Solution
A device integrating both Time of Flight (ToF) and visible image sensor (VIS) pixels on a common plane, with a ToF communication channel and a VIS communication channel, allowing for simultaneous data collection and processing of depth and color images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate ToF and camera systems are used, then depth sensing and visible imaging functions are achieved, but system complexity, cost, and weight increase
Solution Approach 1:
The patent combines ToF sensor pixels and visible image sensor pixels into a single integrated sensor device with a unified pixel array. This merging eliminates the need for separate ToF and camera systems, directly reducing system complexity, cost, and weight while maintaining both depth sensing and visible imaging capabilities through shared hardware components including optics and processing units.
Solution Approach 2:
The integrated sensor device performs multiple functions simultaneously - it captures both depth information via ToF pixels and visible light color images via VIS pixels within a single device. This multi-functionality allows the system to replace multiple specialized sensors with one universal sensor platform, reducing overall system complexity and component count.
2Adaptability or versatility
If separate ToF and camera systems are used, then depth sensing and visible imaging functions are achieved, but hardware weight increases
Solution Approach 1:
The patent merges ToF and visible imaging sensors into a single integrated device, eliminating duplicate hardware components such as separate optics, mounting structures, and processing units. This consolidation directly reduces the total weight of the sensing system while maintaining full functionality for both depth sensing and visible imaging applications.
3Adaptability or versatility
If separate ToF and camera systems are used, then depth sensing and visible imaging functions are achieved, but system cost increases
Solution Approach 1:
The integrated sensor device combines ToF and visible imaging pixels on a single substrate with shared readout circuitry and processing units. This merging reduces manufacturing costs by eliminating the need to produce, test, and assemble multiple separate sensor systems, while simplifying the supply chain and reducing inventory requirements for both ToF and camera components.
4Measurement precision
If ToF pixels are arranged among VIS pixels on a common plane, then spatial resolution and sensing performance are improved, but manufacturing complexity increases
Solution Approach 1:
The patent implements local quality by assigning different functional characteristics to different regions of the pixel array - ToF pixels for depth measurement and VIS pixels for color imaging. This localized functional differentiation allows each pixel type to be optimized for its specific purpose while maintaining a regular, manufacturable overall grid pattern that simplifies the manufacturing process compared to irregular arrangements.
Solution Approach 2:
The pixel array is segmented into distinct ToF and VIS pixel regions with dedicated readout circuitry for each sensor type. This segmentation allows independent optimization and testing of each sensor subtype while maintaining a unified device structure, reducing manufacturing complexity compared to fully integrated mixed-pixel designs.
5Device complexity
If integrated ToF and VIS sensor is used, then cost and weight are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the pixel array into distinct ToF and VIS regions with dedicated readout circuitry, allowing each sensor type to be manufactured and tested independently before final integration. This segmentation reduces the overall manufacturing precision requirements compared to fully heterogeneous integrated designs, as each segment can be optimized separately using established manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated solution improves sensing performance, reduces cost and weight, and enhances the ability to reduce accidents by providing accurate depth and color information in a single device, thereby simplifying system interactions and reducing hardware complexity.
Implementation Method 1
Time of flight (ToF) systems are a type of imaging system that measures the time it takes for light to travel from the system to an object and back
Implementation Method 2
Image sensors convert light into electrical signals
Implementation Method 3
one or more vertical-cavity surface-emitting lasers (VCSELs) configured to emit light within the predetermined wavelength range
Data Source
AI summary
Example embodiments relate to devices, systems, and methods involving three-dimensional time-of-flight/visible image sensors. An example embodiment includes a device that includes a plurality of time of flight sensor (ToF) pixels and a plurality of visible image sensor (VIS) pixels. The device also includes a ToF communication channel configured to provide ToF image data indicative of one or more ToF pixels and a VIS communication channel configured to provide VIS image data indicative of one or more VIS pixels. The plurality of ToF pixels and the plurality of VIS pixels are arranged along a plane. The plurality of ToF pixels is disposed in an arrangement among the plurality of VIS pixels.


