Integrated Touch Array Substrate Manufacturing Process
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing integrated touch array substrates are cumbersome, leading to high production costs and long cycles due to complex processes.
Innovation Solution
A method involving the sequential deposition and patterning of metallic, insulating, and semiconductor layers, including the formation of via holes for electrical connections, to create a new transistor structure with the source electrode under the semiconductor layer and the gate, drain, and touch signal lines on the same layer, all formed with the same mask to reduce technical processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the prior art method for preparing integrated touch array substrate is used, then the substrate can be manufactured with required functionality, but the manufacturing process becomes cumbersome resulting in high production cost and long cycle
Solution Approach 1:
The patent combines multiple manufacturing steps into fewer integrated processes. Specifically, the source electrode, data line, and shading layer are formed simultaneously in one step, and the gate electrode, drain electrode, and touch signal line are formed together in another step. This merging of operations reduces the total number of manufacturing steps, simplifies the process, and shortens the production cycle while maintaining all required functionalities.
Solution Approach 2:
The patent employs multi-functional layers that serve multiple purposes. The first metallic layer simultaneously provides the source electrode, data line, and shading layer functions. The second metallic layer simultaneously provides the gate electrode, drain electrode, and touch signal line functions. This multi-functionality approach reduces the number of separate manufacturing steps required, thereby improving ease of manufacture and reducing production cycle time.
2Ease of manufacture
If the prior art method for preparing integrated touch array substrate is used, then the substrate can be manufactured with required functionality, but the manufacturing process becomes cumbersome resulting in high production cost
Solution Approach 1:
The patent combines multiple manufacturing steps into fewer integrated processes. Specifically, the source electrode, data line, and shading layer are formed simultaneously in one step, and the gate electrode, drain electrode, and touch signal line are formed together in another step. This merging of operations reduces the total number of manufacturing steps, simplifies the process, and shortens the production cycle while maintaining all required functionalities.
Solution Approach 2:
The patent employs multi-functional layers that serve multiple purposes. The first metallic layer simultaneously provides the source electrode, data line, and shading layer functions. The second metallic layer simultaneously provides the gate electrode, drain electrode, and touch signal line functions. This multi-functionality approach reduces the number of separate manufacturing steps required, thereby improving ease of manufacture and reducing production cycle time.
Data Source
AI summary
A method of manufacturing an array substrate and an array substrate are provided. The method includes steps of providing a first metallic layer, a semiconductor layer, a second metallic layer, a common electrode layer, a protecting layer, and a pixel electrode layer on a substrate in sequence. The semiconductor layer is electrically connected to a source electrode of the first metallic layer through a first via hole. Part of the semiconductor layer is electrically connected to a drain electrode of the second metallic layer. A touch electrode is electrically connected to a touch signal line through a second via hole. The pixel electrode layer is electrically connected to the drain electrode through a third via hole.