Integrated Touch Display Panel Manufacturing via Interlayer Bonding
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Solution Overview
Problem
The existing manufacturing process for display devices with touch recognition and image display functions is inefficient due to the need for separate production and bonding of touch and display panels, resulting in increased manufacturing time and expense.
Innovation Solution
A display device with a simplified manufacturing process that integrates a touch panel and a display panel using a flexible substrate with a thin film encapsulation layer, sensing electrodes, and a conductive member, where the touch sensor layer is bonded to the display panel using an interlayer that serves both as a protective layer and a bonding agent, reducing the complexity and cost of the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a separate touch panel and display panel are manufactured and then bonded together, then touch recognition function and image display function are achieved, but manufacturing time and expense increase
Solution Approach 1:
The patent combines the touch sensor layer and display panel into a single integrated structure. The touch sensor layer is formed directly on the display panel substrate, eliminating the need for separate manufacturing and bonding processes. This merging of functions into one panel structure directly reduces manufacturing time and expense while maintaining both touch recognition and image display capabilities.
Solution Approach 2:
The display panel substrate serves multiple functions simultaneously: it acts as the structural base for the display panel, the substrate for forming the touch sensor layer, and the bonding surface for connecting to the touch sensor. This multi-functionality eliminates the need for separate dedicated components and processes, improving manufacturing efficiency.
2Adaptability or versatility
If a separate touch panel and display panel are manufactured and then bonded together, then touch recognition function and image display function are achieved, but device complexity increases
Solution Approach 1:
The patent merges the touch sensor layer formation process with the display panel manufacturing process. Both layers are formed on the same substrate using sequential deposition steps, reducing the number of separate manufacturing stages and simplifying the overall device structure.
Solution Approach 2:
The touch sensor layer is segmented into multiple functional sub-layers (sensing electrode layer, insulating layer, conductive member layer) that can be formed using standard thin-film deposition techniques already employed in display manufacturing, making the complex function achievable through familiar process steps.
3Productivity
If the touch sensor layer is formed on the display panel substrate, then manufacturing process is simplified, but layer structure complexity increases
Solution Approach 1:
The touch sensor layer is divided into distinct functional sub-layers: sensing electrode layer, insulating layer, and conductive member layer. Each sub-layer performs a specific function and can be formed using independent deposition steps, making the complex overall structure manageable through modular construction.
Solution Approach 2:
The insulating layer acts as an intermediary between the sensing electrode layer and the conductive member layer, providing electrical isolation where needed while allowing the structure to maintain its compact integrated form. This intermediary layer enables the complex multi-functional structure to coexist in a thin profile.
Data Source
AI summary
A display device includes a first substrate including a first area and a second area, light emitting elements arranged in the first area, connecting pads arranged in the second area, a thin film encapsulation layer arranged on the light emitting elements, a second substrate including a third area and a fourth area, sensing pads arranged in the fourth area, a touch sensor layer including sensing electrodes arranged in the third area and sensing lines connected between the sensing electrodes and the sensing pads, an interlayer arranged between the thin film encapsulation layer and the touch sensor layer, and a conductive member connected between the connecting pads and the sensing pads.