Integrated Transceiver Lightpipe Coupler Alignment
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Solution Overview
Problem
Current optical transceivers face challenges in achieving high bandwidth and reduced form factor for 10G optical interconnects over distances up to 2 km, with existing designs being costly and requiring complex alignment and assembly processes.
Innovation Solution
The integration of semiconductor electronic devices on a single die with edge or surface-operating photodetectors and lasers, optically coupled via a ferrule and optical coupling elements, allows for a compact transceiver configuration that reduces alignment requirements and eliminates the need for pigtailed devices and laser welding steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional optical transceiver designs are used, then optical signal transmission is achieved, but the form factor is large and alignment requirements are complex
Solution Approach 1:
The patent merges the optical detector, optical coupler, and electronic circuitry onto a single semiconductor die. The detector is formed directly on the die surface, the coupler is integrated as an optical waveguide structure on the same die, and electrical interconnections are made through conductive vias and traces. This integration eliminates the need for separate alignment of discrete optical components, reducing both form factor and alignment complexity.
Solution Approach 2:
The patent replaces mechanical alignment and assembly of separate optical components with a monolithic semiconductor fabrication process. Instead of mechanically positioning and bonding discrete detectors and couplers, the optical path is defined by lithographically patterned waveguides and photodetector regions formed through standard semiconductor processing steps, eliminating mechanical alignment requirements.
2Ease of manufacture
If discrete optical components are used, then optical functionality is achieved, but manufacturing cost increases due to pigtailed devices and laser welding steps
Solution Approach 1:
The patent combines multiple discrete optical components into a single integrated device on one semiconductor die. The optical coupler is formed as an integrated waveguide structure, the detector is formed as a photodetector region on the die, and electrical connections are made through conductive vias and traces rather than requiring laser welding of separate components. This eliminates pigtailed devices and laser welding steps, reducing manufacturing cost and complexity.
3Measurement precision
If edge-operating photodetectors are used, then detection sensitivity is improved, but alignment precision requirements increase
Solution Approach 1:
The patent merges the edge-operating photodetector with an integrated optical coupler formed as a waveguide structure on the same die. The waveguide is lithographically defined and etched to precisely guide light to the photodetector's active edge region. This integration ensures precise optical coupling without requiring external alignment, as the waveguide and photodetector are fabricated together in a single semiconductor processing sequence with inherent alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the development of small form factor transceivers that support 10G optical interconnects over 2 km with reduced costs and improved heat sinking, facilitating faster data rates and easier manufacturing.
Implementation Method 1
The optical coupler can include a light pipe having a length of substantially optically transmissive material... The second end can include a sloping reflective surface angled such that light propagating along the length from the first end to the second end is redirected to the optical detector
Implementation Method 2
The receiver in the optical transceiver is typically a device such as a photodetector that converts optical input signals into electrical output signals
Data Source
AI summary
A transceiver comprising a CMOS chip and a laser coupled to the chip may be operable to communicate an optical source signal from a semiconductor laser into the CMOS chip. The optical source signal may be used to generate first optical signals that are transmitted from the CMOS chip to optical fibers coupled to the CMOS chip. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the CMOS chip. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The optical source signal may be communicated into the CMOS chip and the first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers.