Integrated Transformer Module With Overmolded Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power supplies and DC-DC converters require large discrete magnetic components that suffer from inherent losses, heat generation, electromagnetic interference, and high fabrication costs, making them unsuitable for small, efficient, and cost-effective applications in battery-operated devices.
Innovation Solution
The development of an integrated transformer module fabricated using plated metal layers on a substrate, where the transformer is integrated into the substrate and connected to other components, and overmolded with an insulating material for environmental protection and electrical isolation, allowing for reduced size and increased current transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If discrete magnetic components are used in conventional power supplies, then the components can provide necessary magnetic functions, but the components become large in size and generate heat and electromagnetic interference
Solution Approach 1:
The patent combines the transformer with the substrate to form an integrated transformer module. The transformer windings are formed using plated metal layers directly on the substrate, and the entire assembly is overmolded with insulating material to create a single integrated unit. This merging eliminates the need for separate discrete magnetic components, reducing overall size and improving thermal and electromagnetic characteristics.
Solution Approach 2:
The patent changes the physical state and arrangement of the transformer components by forming windings through plating processes and embedding them in an overmolded structure. This parameter change from discrete to integrated construction reduces the volume and harmful effects while maintaining functional performance.
2Device complexity
If transformer windings are fabricated on silicon substrates using metal layers, then the components can be integrated, but adequate isolation between high-voltage components cannot be achieved due to small clearance
Solution Approach 1:
The patent introduces an overmolded insulating material as an intermediary between the transformer windings and other circuit components. This molding material provides the necessary electrical isolation and clearance for high-voltage components, enabling adequate isolation while maintaining the integrated structure on the silicon substrate.
Solution Approach 2:
The patent uses a composite structure combining plated metal layers, substrate materials, and overmolded insulating material. This composite approach allows the integration of transformer windings on silicon while providing the required electrical isolation through the molding material, resolving the contradiction between integration and isolation.
3Ease of manufacture
If large electronic components are located on a substrate separate from the silicon die, then the components can be connected, but space is consumed by copper traces
Solution Approach 1:
The patent merges the transformer and electronic components onto the same silicon substrate, eliminating the need for separate substrates and reducing the space required for copper traces. The integrated module allows direct connection of components without requiring extensive external interconnect structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated transformer module achieves smaller size, higher current transmission, and improved electrical isolation, making it suitable for high-current DC-DC converter applications while reducing costs and minimizing heat and interference issues.
Implementation Method 1
transformers in a module are fabricated using plated metal layers on a substrate
Implementation Method 2
first and second top windings of the transformer made of the metal that is located on the core
Implementation Method 3
overmolding the electronic components with an insulating molding material
Data Source
AI summary
A module includes a substrate, metal layers and insulating layers laminated on the substrate, a bottom winding made of a metal directly contacting a first metal layer or a second metal layer, a first insulating layer on the bottom winding, a core on the first insulating layer, a second insulating layer on the core, a top winding made of the metal that is located on the core and a portion of the second insulating layer and that directly contacts the first metal layer or the second metal layer, and a third insulating layer on the top winding, electronic components that are located on the third insulating layer, where primary and secondary windings of the transformer are defined by portions of the bottom winding and the top winding and are located on opposite sides of the core from each other.