Integrated Transformer Power Transfer with Hysteretic Voltage Control

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Solution Overview

Problem

Conventional high-power systems face challenges in achieving efficient and cost-effective power transfer across an isolation barrier due to the size and cost of standard transformers, which are prohibitive for some applications.

Innovation Solution

A low-cost isolated power transfer device with a transformer formed on an insulating substrate within an integrated circuit package, utilizing a DC/AC power converter and AC/DC power converter circuits, along with a hysteretic feedback mechanism to regulate output voltage, and employing high-efficiency components like Schottky diodes and LDMOS transistors to manage high voltage levels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a standard transformer is used for power transfer, then power transfer efficiency is improved (70%-95%), but device size and cost increase to prohibitive levels

Engineering Contradiction:

Improvepower transfer efficiencyVSAvoidtransformer size

Core Design Contradiction:

Loss of energyVSVolume of stationary object

Solution Approach 1:

The transformer is integrated directly into the IC package by forming conductive coils on the same substrate as the power converter circuits, merging previously separate components (transformer and power converter) into a single integrated structure, thereby reducing overall device size while maintaining efficient power transfer

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The transformer coils are formed within the same IC package substrate, nesting the transformer structure inside the power converter device boundaries, allowing the transformer to occupy space within the existing package footprint rather than requiring external mounting space

Inventive Principle:

Principle #7Nested doll (Nesting)

2Loss of energy

If a standard transformer is used for power transfer, then power transfer efficiency is improved (70%-95%), but device cost increases to prohibitive levels

Engineering Contradiction:

Improvepower transfer efficiencyVSAvoiddevice cost

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent uses standard IC fabrication processes to create the transformer coils from conductive materials already present in the manufacturing flow, replacing expensive custom-transformer assemblies with cost-effective integrated circuit manufacturing techniques

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Volume of stationary object

If the transformer is integrated within the IC package, then device size is reduced, but manufacturing complexity increases

Engineering Contradiction:

Improvedevice sizeVSAvoidintegration complexity

Core Design Contradiction:

Volume of stationary objectVSDevice complexity

Solution Approach 1:

The IC substrate serves multiple functions: it acts as the base for power converter circuits, provides the medium for forming transformer coils, and serves as the structural platform for the complete integrated device, thereby managing complexity through multi-functional use of existing manufacturing capabilities

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables high-efficiency power transfer with reduced size and cost, supporting high voltage levels and providing built-in fault tolerance, while integrating the transformer within the package to minimize board space and material costs.

Implementation Method 1

The first conductive coil is configured to transfer power via the second conductive coil from the input power supply node to an output power supply node. The input power supply node is electrically isolated from the output power supply node.

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS10326375B1Isolated power transfer with integrated transformer and voltage control

Publication Date: 2019.06.18 SKYWORKS SOLUTIONS INC

AI summary

An isolated power transfer device has a primary side and a secondary side isolated from the primary side by an isolation barrier. A secondary-side circuit includes a rectifier circuit coupled to a secondary-side conductive coil. The secondary-side circuit includes a first resistor coupled to a first power supply node and a terminal node. The secondary-side circuit includes a second resistor coupled to the terminal node and a second power supply node. The secondary-side circuit includes a first circuit to generate a feedback signal in response to a reference voltage and a signal on the terminal node. The feedback signal has a hysteretic band defined by the first resistor and the second resistor. The secondary-side circuit is configured as an AC/DC power converter that provides, on the first power supply node, an output DC signal having a voltage level based on a ratio of the first resistor to the second resistor.