Integrated Transistor-Diode Module Without Wire Bonding
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Solution Overview
Problem
Existing semiconductor devices face issues with wiring failures and increased switching losses due to the need for wire bonding between transistors and diodes, which also occupies unnecessary space.
Innovation Solution
Integration of transistors and diodes within a semiconductor device using shared terminals or common metal layers, eliminating the need for wire bonding and reducing device area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect transistors and diodes, then electrical connectivity is achieved, but wiring failures and switching losses increase
Solution Approach 1:
The patent merges the transistor and diode into a single integrated device structure, eliminating the need for wire bonding between separate components. The shared terminal design integrates both devices' electrical connections through common metal layers and terminals, directly resolving the wiring reliability and complexity issues by removing the wire bonding process entirely.
2Reliability
If wire bonding is used to connect transistors and diodes, then electrical connectivity is achieved, but device area increases
Solution Approach 1:
The integrated device structure combines transistor and diode functions within a single package footprint, eliminating the space required for wire bonding and associated clearance areas. The shared terminal architecture allows both devices to utilize common metal interconnects, significantly reducing the overall device area while maintaining reliability.
3Ease of manufacture
If separate mounting of transistors and diodes is performed, then manufacturing flexibility is maintained, but manufacturing complexity and time increase
Solution Approach 1:
The patent combines transistor and diode mounting into a single integrated assembly process. The shared terminal structure allows both devices to be mounted simultaneously using common attachment points and metal layers, eliminating sequential mounting steps and significantly improving manufacturing productivity while maintaining ease of manufacture through standardized processes.
Data Source
AI summary
A semiconductor device that may include a module. A transistor mounted to the module. A diode mounted to the module, wherein the module is integrated to the transistor.