Integrated Vapor Chamber PCB Assembly for Thermal Management
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Solution Overview
Problem
Conventional thermal management solutions for thermally sensitive integrated circuit packages are inadequate due to reliance on exposed printed circuit board (PCB) pads for heat transfer, which limits cooling efficiency and benefits the circuit card assembly as a whole.
Innovation Solution
A multi-layer printed circuit board (PCB) with integrated vapor chambers, where a working fluid absorbs heat from an evaporator surface, boils, and condenses at a condenser surface, with a capillary structure returning the fluid to the evaporator, enhancing heat dissipation through a capillary or wick structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional cooling solutions using exposed PCB pads are used, then the structure is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent merges the cooling function with the PCB structure by integrating a vapor chamber directly into the PCB substrate. The vapor chamber is formed by creating a cavity within the PCB layers and sealing it with thermally conductive adhesive, combining the structural support function of the PCB with the heat dissipation function of the vapor chamber, thereby resolving the contradiction between structural simplicity and heat dissipation efficiency
Solution Approach 2:
The patent utilizes phase transitions of the working fluid within the vapor chamber to enhance heat dissipation. The fluid evaporates at the evaporator surface absorbing heat from hot components, then condenses at the condenser surface releasing heat to the PCB, and repeats this cycle through capillary action in the wick structure. This phase change mechanism provides superior heat transfer efficiency compared to conventional conduction-only approaches while maintaining structural integration
2Temperature
If PCB temperature is reduced to benefit CCA components, then thermal management improves, but heat transfer path is limited
Solution Approach 1:
The patent introduces a vapor chamber as an intermediary heat transfer device between the hot IC package and the PCB. The vapor chamber with its working fluid acts as a thermal mediator that efficiently transfers heat from the evaporator surface (contacting the IC) through phase change to the condenser surface (contacting the PCB), thereby reducing PCB temperature while providing an enhanced heat transfer path that overcomes the limitations of direct conduction through PCB pads
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases heat dissipation efficiency by utilizing a vapor chamber within the PCB to transfer and dissipate heat externally, improving thermal management for thermally sensitive components.
Implementation Method 1
the working fluid absorbs heat from the evaporator surface and boils in the process
Implementation Method 2
the working fluid absorbs heat from the evaporator surface and boils in the process
Implementation Method 3
at which the working fluid condenses, its transferred heat absorbed by the condenser surface
Implementation Method 4
the working fluid condenses, its transferred heat absorbed by the condenser surface
Implementation Method 5
The vapor chamber incorporates a capillary or wick structure for collecting the condensed working fluid and returning the working fluid to the evaporator surface
Data Source
AI summary
A circuit card assembly (CCA) is disclosed. In embodiments, the CCA includes a printed circuit board (PCB) comprising a series of adjacent substrate layers. Evaporator layers include an evaporator surface thermally connected to CCA components and capable of absorbing heat therefrom. A series of wall layers include apertures collectively defining an integrated vapor chamber extending between the evaporator layers and condenser layers including a condenser surface opposite the evaporator surface. A working fluid within the vapor chamber is boiled by heat transferred from the evaporator surface and re-condenses at the condenser surface, which transfers heat from the working fluid. The re-condensed working fluid is transitioned back to the evaporator surface via capillary wick structures within the internal surfaces of vapor chamber.