Integrated Vapor Chamber Structure for Heat Dissipation
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Solution Overview
Problem
Conventional vapor chamber and heat pipe combinations, when connected by welding, result in thermal resistance, compromising heat conduction efficiency due to gaps between the two components.
Innovation Solution
A vapor chamber structure comprising overlapping first and second plate bodies with capillary structures and working fluid in separate chambers, allowing for integrated large-area heat spreading and remote end heat conduction without thermal resistance, enhancing heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the vapor chamber and heat pipe are connected by welding, then both large-area heat conduction and remote end heat conduction effects are achieved, but thermal resistance increases due to gaps between components
Solution Approach 1:
The patent merges the vapor chamber and heat pipe into a single integrated structure where the heat pipe's evaporating end is directly formed as part of the vapor chamber's inner wall. This eliminates the need for separate welding connections and removes gaps between components, thereby maintaining both large-area heat conduction and remote end heat conduction effects while avoiding thermal resistance issues.
Solution Approach 2:
The heat pipe structure is nested within the vapor chamber structure, with the heat pipe's evaporating end embedded in the vapor chamber's inner wall. This nested arrangement allows the two heat conduction components to work together seamlessly without requiring external welding connections, thus eliminating thermal resistance while achieving both heat conduction effects.
2Adaptability or versatility
If separate vapor chamber and heat pipe components are used, then both large-area and remote end heat conduction functions are achieved, but device complexity increases
Solution Approach 1:
The patent combines the vapor chamber and heat pipe into a single integrated component structure, reducing the number of separate parts. The heat pipe's evaporating end is directly formed as part of the vapor chamber's inner wall structure, eliminating the need for separate assembly and reducing overall device complexity while maintaining both heat conduction functions.
Solution Approach 2:
The integrated structure serves multiple heat conduction functions simultaneously - the vapor chamber provides large-area heat spreading while the integrated heat pipe structure provides remote end heat conduction. This multi-functional design eliminates the need for separate components, thereby reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vapor chamber structure effectively integrates large-area heat spreading and remote end heat conduction, eliminating thermal resistance and improving heat dissipation efficiency by facilitating direct and efficient heat transfer between components.
Implementation Method 1
The capillary structure is disposed on inner surfaces of the first and second chambers. The working fluid is filled in the first and second chambers.
Implementation Method 2
The working fluid is filled in the first and second chambers. The vapor chamber structure has both large-area heat spreading effect and remote end heat conduction effect.
Data Source
AI summary
A vapor chamber structure includes a main body. The main body has a first section, a second section, a capillary structure and a working fluid. The first section has a first chamber. The second section has a second chamber. The second section extends from one end of the first section in a direction away from the first section. The capillary structure is disposed on inner surfaces of the first and second chambers. The working fluid is filled in the first and second chambers. The vapor chamber structure has both heat spreading effect and remote end heat dissipation effect.