Integrated Vital Sign Sensor Module with Micro-LEDs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current vital sign monitoring systems require large and expensive components for measuring parameters like heart rate and oxygen content, which are not suitable for the miniaturization needs of wearable devices.
Innovation Solution
Integration of emitters and detectors on an integrated circuit with micro LEDs and a broadband photodetector, eliminating the need for separate substrates and cabling, and using wafer-level packaging to reduce size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete emitters and detectors are arranged in a side-by-side design in individual cavities, then the components can be manufactured using conventional processes, but the sensor module requires a lot of space and is expensive to manufacture
Solution Approach 1:
The patent merges discrete emitters and detectors into an integrated circuit structure where multiple light-emitting diodes and photodetectors are fabricated on a single semiconductor substrate. This integration eliminates the need for separate cavities and discrete component mounting, significantly reducing the overall sensor module area while maintaining conventional manufacturing compatibility through standard semiconductor fabrication processes
Solution Approach 2:
The patent transitions from a two-dimensional side-by-side arrangement of discrete components in individual cavities to a planar integrated circuit layout where emitters and detectors are arranged in arrays on the semiconductor substrate surface. This dimensional reorganization allows for compact packing of multiple components without requiring vertical cavity structures, thereby reducing the sensor module footprint
2Ease of operation
If discrete emitters and detectors are arranged in individual cavities, then each component can be independently positioned, but the sensor module is expensive to manufacture due to required backend materials and processes
Solution Approach 1:
The patent combines multiple discrete components into a single integrated circuit chip where emitters and detectors are fabricated together on the same semiconductor substrate. This merger eliminates the need for separate cavity structures, individual component mounting, and associated backend materials, significantly reducing manufacturing costs while maintaining precise component positioning through integrated fabrication processes
Solution Approach 2:
The patent uses semiconductor fabrication techniques to create precise replicas of emitter and detector structures directly on the substrate through photolithography and other copying processes. This approach replaces expensive discrete component assembly with cost-effective pattern replication, achieving accurate component positioning without requiring individual cavities or manual placement
3Ease of manufacture
If conventional discrete components are used for vital sign monitoring, then the system can be manufactured with existing technology, but the components do not meet the miniaturization requirements of wearable devices
Solution Approach 1:
The patent integrates multiple optical components (light-emitting diodes and photodetectors) into a single semiconductor chip structure, reducing the overall component volume from discrete assemblies to a compact integrated unit. This integration maintains compatibility with existing semiconductor manufacturing technology while achieving the miniaturization required for wearable device applications
Solution Approach 2:
The patent changes the physical state and scale of optical components by fabricating micro-scale light-emitting diodes and photodetectors directly on the semiconductor substrate using standard fabrication processes. This parameter change from macro-scale discrete components to micro-scale integrated structures enables miniaturization while maintaining manufacturability with existing technology
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, cost-effective sensor module with high measurement accuracy, suitable for wearable devices, capable of detecting vital parameters with reduced space and manufacturing costs.
Implementation Method 1
A PPG is often obtained with a pulse oximeter that illuminates the skin and measures changes in light absorption based on the light reflected back from the skin. The reflected-back signal detected by a photodiode...
Implementation Method 2
μLEDs, i.e. very small LEDs, are used as emitters... at least one LED, wherein the μLED is arranged on two of the plurality of contact elements
Data Source
AI summary
A sensor module, in particular for detecting a vital sign parameter, includes a semiconductor body with a first main surface and a second main surface opposite the first main surface. The sensor module also includes an integrated circuit integrated in the semiconductor body, and a photodetector integrated in the semiconductor body and arranged on the first main surface. The photodetector is controllable by means of the integrated circuit. The sensor module further includes a plurality of contact elements on the first main surface of the semiconductor body. The plurality of contact elements are electrically connected to the integrated circuit. The sensor module additionally includes at least one μLED arranged on two of the plurality of contact elements and electrically connected thereto.