Integrated Wafer Aligner for On-the-Fly Robot Alignment
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Solution Overview
Problem
Conventional semiconductor processing equipment with specialized stand-alone wafer aligners at the end of the EFEM requires significant wafer transport robot travel time, leading to increased cycle time, reduced throughput, and larger tool footprint, along with cleanliness challenges due to protruding enclosures.
Innovation Solution
Integrate a wafer spinner with a rotary drive into the wafer transport apparatus for on-the-fly alignment, allowing alignment during transport without transferring wafers to a fixed station, thus reducing travel time and eliminating the need for protruding enclosures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If specialized stand-alone wafer aligners are mounted at the end of the EFEM, then wafer alignment and identification functions are provided, but wafer transport robot travel time and waiting time increase significantly
Solution Approach 1:
The patent merges the wafer aligner with the wafer transport robot by mounting the aligner onto the robot itself. This integration allows the robot to perform alignment functions while transporting wafers, eliminating the need for separate alignment stations and reducing robot travel time between alignment and transport locations.
Solution Approach 2:
The patent makes the wafer aligner dynamic by mounting it on the moving robot platform rather than fixing it to the EFEM enclosure. This allows the aligner to move with the robot, enabling alignment to occur at various positions during the robot's operational cycle rather than requiring dedicated stationary alignment stations.
2Measurement precision
If specialized stand-alone wafer aligners are mounted at the end of the EFEM, then wafer alignment functions are provided, but cycle time increases due to waiting time
Solution Approach 1:
The patent combines multiple functions (transport and alignment) into a single integrated system. The robot performs both wafer transport and alignment operations without requiring separate dedicated stations, thereby reducing idle waiting time and improving overall wafer throughput.
Solution Approach 2:
The integrated robot-aligner system enables continuous operation where alignment and transport occur in a seamless workflow. The robot can begin transport operations immediately after alignment without requiring separate positioning and waiting periods, maintaining continuous productive action.
3Measurement precision
If specialized stand-alone wafer aligners are mounted at the end of the EFEM, then wafer alignment functions are provided, but the tool footprint increases due to protruding bumpout enclosures
Solution Approach 1:
The patent eliminates the need for separate protruding enclosures by integrating the aligner into the robot structure. This consolidation allows the alignment function to be performed within the existing EFEM footprint without requiring additional external space or bumpout structures.
Solution Approach 2:
The robot platform serves multiple functions: it acts as both the transport vehicle and the mounting platform for the aligner. This multi-functionality eliminates the need for dedicated single-purpose enclosures, reducing the overall tool footprint while maintaining all necessary functions.
4Measurement precision
If specialized stand-alone wafer aligners are mounted at the end of the EFEM, then wafer alignment functions are provided, but manufacturing cost increases
Solution Approach 1:
The patent reduces manufacturing cost by consolidating the aligner and robot into a single integrated unit. This eliminates the need to manufacture and install separate stand-alone aligner enclosures, reducing material costs, assembly complexity, and installation requirements.
Solution Approach 2:
The robot platform is designed to serve multiple purposes (transport and aligner mounting), maximizing the utilization of existing components and reducing the need for additional dedicated structures. This multi-functionality reduces overall system cost while maintaining full operational capability.
5Measurement precision
If specialized stand-alone wafer aligners are mounted at the end of the EFEM, then wafer alignment functions are provided, but cleanliness is compromised due to lateral non-laminar flow patterns
Solution Approach 1:
The patent eliminates protruding static enclosures by making the aligner dynamic and mobile on the robot platform. This removes the source of lateral non-laminar flow disruptions, allowing uniform laminar airflow patterns to be maintained throughout the EFEM enclosure for improved cleanliness control.
Solution Approach 2:
By integrating the aligner with the robot, the patent eliminates the need for separate protruding enclosures that disrupt airflow. The combined system maintains a streamlined profile that does not interfere with the laminar flow patterns required for controlling airborne particulates in the cleanroom environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances wafer throughput, improves cleanliness, minimizes environmental disturbance, reduces manufacturing costs, and decreases tool footprint by integrating alignment and transport on a common platform.
Implementation Method 1
a wafer spinner with a rotary drive integrated into the wafer transport apparatus for on-the-fly alignment
Data Source
AI summary
A semiconductor wafer transport apparatus includes a frame, a transport arm movably mounted to the frame and having at least one end effector movably mounted to the arm so the at least one end effector traverses, with the arm as a unit, in a first direction relative to the frame, and traverses linearly, relative to the transport arm, in a second direction, and an edge detection sensor mounted to the transport arm so the edge detection sensor moves with the transport arm as a unit relative to the frame, the edge detection sensor being a common sensor effecting edge detection of each wafer simultaneously supported by the end effector, wherein the edge detection sensor is configured so the edge detection of each wafer is effected by and coincident with the traverse in the second direction of each end effector on the transport arm.