Integrated Water Cooler Assembly for Compact Computing Devices
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Solution Overview
Problem
Current computer cooling systems are complex and costly, particularly those using water cooling, which require pumps, tubing, and radiators, making them less efficient and more expensive than needed for smaller, improved computing devices.
Innovation Solution
A dual-chamber heat transfer apparatus with a pump having an impeller and stator, where liquid coolant is circulated through channels to absorb heat from a cold plate adjacent to a computer processor and transferred to a radiator, utilizing a fan to enhance air circulation and improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water cooling systems are used to cool computer processors, then heat dissipation effectiveness is improved, but device complexity and cost increase due to requiring pumps, tubing, and radiators
Solution Approach 1:
The patent combines the pump, coolant reservoir, and radiator into a single integrated cooling unit that attaches directly to the processor housing. This merging of previously separate components (pump, tubing, radiator) into one unified device reduces device complexity while maintaining water cooling effectiveness for heat dissipation.
2Temperature
If water cooling systems with pumps and radiators are implemented, then heat transfer efficiency is improved, but manufacturing cost increases
Solution Approach 1:
By integrating multiple cooling components into a single manufacturable unit, the patent reduces the number of separate parts that need to be produced, assembled, and tested. This consolidation simplifies the manufacturing process and reduces overall production costs while maintaining effective heat transfer through water cooling.
3Temperature
If traditional water cooling components (pump, tubing, radiator) are used, then cooling performance is improved, but the system size and space requirements increase
Solution Approach 1:
The patent merges the pump, reservoir, and radiator into a compact integrated unit that attaches directly to the processor housing. This consolidation significantly reduces the overall system volume and eliminates the need for extensive tubing and separate components, making the cooling system more suitable for smaller computing devices.
4Temperature
If multiple separate cooling components are used, then heat dissipation capability is improved, but ease of operation and installation deteriorates
Solution Approach 1:
By integrating all cooling components into a single attachable unit, the patent makes installation and operation much easier. Users only need to attach one integrated cooling device to the processor housing rather than installing multiple separate components (pump, tubing, radiator, reservoir), significantly improving ease of operation while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides an efficient and cost-effective cooling solution by simplifying the cooling process, reducing complexity, and enhancing heat transfer efficiency while maintaining optimal computing device temperatures.
Implementation Method 1
As the liquid coolant traverses the cold plate in the lower housing, the liquid coolant may absorb heat absorbed by the cold plate and emanating from the proximate computer processing chip
Implementation Method 2
The pump may receive liquid coolant through an inlet in the upper housing and circulate the liquid coolant through a second chamber reservoir that may be in fluid communication with the first chamber reservoir
Implementation Method 3
The heated liquid coolant may be transferred from the second chamber reservoir to the radiator via an outlet offset from the inlet of the upper housing
Data Source
AI summary
A heat transfer apparatus includes a first chamber horizontally offset from a second chamber to form an upper housing and a lower housing. Preferably, the two chambers do not overlap. The heat transfer apparatus may include a heat exchange interface including a cooler plate fixed to a bottom surface of the lower housing. The heat exchange interface may absorb heat from a proximate heat source and transfer the absorbed heat to an inner surface of the lower housing. The apparatus includes a pump including an impeller and a stator disposed therein. The lower housing may separate the impeller from the stator so that the stator is isolated from the impeller by a surrounding casing. A liquid coolant may be circulated from an inlet, over the heat exchange interface and out to an outlet to remove heat from a processer proximate to the heat exchange interface.